MEMS and Sensors

Report: Intel’s 18 A process attracting big players

09 May 2025

Intel Foundry’s 18 A process technology is apparently in talks to land some big deals in the form of Microsoft, Google and Nvidia.

According to a report from Tom’s Hardware, Nvidia is looking to manufacture a GPU aimed at gamers with Intel Foundry in what would be a major win for the semiconductor manufacturing wing of Intel Corp. Additionally, Google is apparently in talks with Intel Foundry for future chips for a range of applications.

Earlier this month, Intel Foundry announced it was developing a performance-enhancing variant of its 18 A process that would support its Foveros Direct 3D with hybrid bonding interconnects. This will allow the company to stack dies vertically on top of its state-of-the-art processing technology.

The 18 A process is currently in the risk production stage and is expected to enter volume production later this year with the variant expected to launch in 2026. A second variant, 18 A-PT, is expected in 2028. The 18 A process is classified as 2 nanometers and would rival the state-of-the-art production processes of foundry rivals TSMC and Samsung.

Intel also announced its 14 A process node that would be the next generation of semiconductor manufacturing.

Why it matters

Intel has been struggling to regain its footing after a few tumultuous years where it had massive layoffs and missing revenue targets. The company is looking to spin off its RealSense depth sensor division and already has sold the majority stake in Altera. In 2022, Mobileye, the autonomous vehicle division of Intel, conducted an IPO and became its own company.

During its struggles, the company has been investing heavily in its semiconductor fabs, including investing $32 billion to build two new fabs in Arizona. It also expanded its advanced packaging facilities in New Mexico and developing a 300 mm logic and foundry in Hillsboro, Oregon.

Intel also has plans to build two additional semiconductor fabs in Ohio with an additional $28 billion, however, the company has delayed those plans to at least 2030.

This means that currently Intel has the largest number of U.S.-based fabs among global foundries. While TSMC is building an entire ecosystem in Phoenix, Arizona — with three chip fabs, an R&D center and two advanced packaging facilities — Intel has a jump in terms of the structures already constructed.

With the Trump Administration pushing for more homegrown semiconductor manufacturing, tech firms may be looking at Intel with more interest in order to dodge tariffs and geopolitical risks cropping up globally.

To contact the author of this article, email PBrown@globalspec.com


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