Industrial Electronics

Connectivity in mission-critical applications: Smiths Interconnect's innovative solutions at embedded world 2025

26 February 2025

Smiths Interconnect will showcase its latest connectivity solutions at the embedded world exhibition and conference, March 11 to March 13, 2025, in Nuremberg, Germany, booth #4A606, highlighting their commitment to providing high-performance, reliable products for mission-critical applications. The cutting-edge products are designed to meet the stringent demands of the embedded systems industry, ensuring reliable performance.

Mini-Lock Connector

One of the highlights is the new Mini-Lock Connector, which operates at an impressive frequency of up to 110 GHz, making it one of the highest frequency components available on the market. This connector isSource: Smiths InterconnectSource: Smiths Interconnect crucial for applications requiring reliable and rapid data transmission, such as satellites, space flight, radars, unmanned vehicles and communication devices.

The Mini-Lock Connector features a patent-pending robust locking mechanism, ensuring a secure connection even under high stress, vibration and shock conditions. It is designed to perform in extreme temperatures ranging from -65° C to 165° C, making it suitable for the harshest environments. Its compact and lightweight design further enhances its appeal for embedded applications where every gram matters.

TSX Wire Bondable Fixed Chip Attenuator Series

The new TSX Wire Bondable Fixed Chip Attenuator series is a small, cost-effective, easy-to-implement, high-reliability wire bondable attenuator solution qualified for demanding applications. The Series is qualified toSource: Smiths InterconnectSource: Smiths Interconnect MIL-PRF-55342 and designed to offer excellent broadband performance up to 50 GHz, while delivering increased power handling in a small 0404 wire bondable package. It allows wider coverage than traditional components while providing optimized return loss for multiple frequency ranges. This allows the customer to use a single chip in multiple applications, reducing the bill of material item count and consequently, the cost of ownership. The new TSX WB2 series can be ordered in group A, B or C testing based on MIL-PRF-55342. Qualification data is included with product delivery for program assurance.

To contact the author of this article, email GlobalSpecEditors@globalspec.com


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