At its first event -- Intel Foundry Direct Connect -- Intel Foundry, formerly known as Intel Foundry Services, expanded its process technology roadmap into the latter part of the decade including its 14A leading-edge node.
Intel Foundry said its business is designed for artificial intelligence in that it will manufacture chips for companies globally to create new markets as well as change how technology is used across all industries.
Additionally, Intel Foundry has included new tools, design flows and intellectual property (IP) portfolios from Synopsys, Cadence, Siemens and Ansys for its advanced packaging and Intel 18A process technologies.
Foundry roadmap
Intel unveiled its updated process technology roadmap that includes the addition of Intel 14A, a leading-edge node, as well as several specialized nodes.
Intel said it remains on track to deliver five process nodes in four years which includes what it claims is the industry’s first backside power solution.
The roadmap includes the evolutions for Intel 3, Intel 18A and Intel 14A process nodes as well as Intel 3-T—a through-silicon vias for 3D advanced packaging designs.
Mature process nodes will also be expanded with a new 12 nanometer nodes through the joint deal with United Microelectronics Corp. (UMC)—a foundry agreement that will use UMC’s technological services with Intel’s existing fabs for joint operations. The deal also gives UMC the ability to leverage advanced manufacturing capabilities like FinFET without needing heavy investment capital.
Other roadmap highlights include its FCBGA 2D+ suite of ASAT offerings like:
- FCBGA 2D
- EMIB
- Foveros
- Foveros Direct
Earlier this year, Intel opened its first mass production 3D chip packaging site in Rio Rancho, New Mexico, as part of its $3.5 billion investment to improve manufacturing and operations for packaging, like the Foveros 3D packaging technology.
“We are offering a world- class foundry, delivered from a resilient, more sustainable and secure source of supply, and complemented by unparalleled systems of chips capabilities,” said Stuart Pann, senior VP of Intel Foundry. “Bringing these strengths together gives customers everything they need to engineer and deliver solutions for the most demanding applications.”
