The availability of a 5 nm 200G/lane optical pulse amplitude modulation 4-level (PAM-4) digital signal processor (DSP) physical layer (PHY) was unveiled at the 49th European Conference on Optical Communication (ECOC 2023) by Broadcom.
Called the BCM85822, the device enables optical transceiver vendors to cost effectively deliver 800G and 1.6T pluggable modules. Broadcom said this will meet the growing bandwidth needs and low power consumption requirements of hyperscale data centers.
Features of the BCM85822 include:
- Integrated laser driver
- Interoperability with Broadcom’s 200G EML
- IEEE and OIF standard compliant
- Chip to module electrical interface
- Supports optical modules from 800G to 3.2T
- Supports IEEE compliant (128,120) hamming inner code
Broadcom said due to increasing bandwidth demands from artificial intelligence (AI) workload in hyperscale data centers, the PAM-4 PHY would double the bandwidth capacity per 1RU without changing the existing infrastructure.
The BCM85822 can be used for next generation switches and scale AI workloads.
