Semiconductor equipment maker Lam Research has unveiled what it claims is the first bevel deposition technology designed for manufacturing of logic, 3D NAND and advanced packaging solutions.
Called Coronus DX, in a single step the technology deposits a proprietary layer of protective film on both sides of the wafer edge that helps prevent defects and damage that can occur during semiconductor manufacturing. The goal is to protect the wafers to increase yield as well as implement new processes for next-generation chips.
Coronus DZ complements Lam’s Coronus bevel etch technology through enabling new device structures. Lam said repeated layers of processing can cause residues and roughness to accumulate along the wafer edge. This can create defects that cause a chip device to fail.
When these defects cannot be etched away, Coronus DX deposits a thin dielectric layer of protection on the bevel. The deposition helps resolve these common issues that may impact semiconductor quality, Lam said.
"CEA-Leti applied its expertise in innovative, sustainable technology solutions to help Lam Research tackle key challenges in advanced semiconductor manufacturing," said Anne Roule, head of the semiconductor platform division at CEA-Leti. "By simplifying 3D integration, Coronus DX drives significantly higher yield and enables chipmakers to adopt breakthrough production processes."
