Semiconductor equipment maker Lam Research has acquired wet processing semiconductor equipment maker Semsysco GmbH, gaining advanced packaging capabilities for logic chips and chiplets.
The packaging could be used for applications such as high-performance computing (HPC), artificial intelligence and other data-intensive sectors.
This includes the support for fan-out panel-level packaging, where chips or chiplets are cut from large, rectangular substrate sheet several times the size of a traditional silicon wafer. This enables chipmakers to increase yield while reducing waste.
“Packaging plays an important role in extending Moore’s Law and enabling future leadership products with higher levels of system in package integration. New substrate-based panel-level approaches are vital to cost-effectively realizing the high-performance chiplet-based solutions needed for the digital world,” said Keyvan Esfarjani, chief global operations officer at Intel Corp. “We are pleased to expand our deep, long-standing relationship with Lam to include advanced cleaning and plating processes in the new panel form factor.”
Additionally, Lam said it will obtain an R&D facility in Austria focused on substrates and heterogeneous packaging. The factory, which will be Lam’s sixth, will help extend its capabilities in Europe and expand relationship with chipmakers and fabless vendors.