TechInsights Teardown: Samsung Galaxy Z Flip4

When mobile handsets first were developed, flip phones became highly popular due to their ability to meet a slim form factor. As touchscreen phones become available, their popularity faded.

But that was temporary, as the flip phone form factor has made a comeback, mostly due to the ability to combine touchscreens inside both aspects of the flip phone, making it much like a fully featured touchscreen but with a smaller form factor.

As the popularity of the flip phones gained traction, telecoms naturally started to invest heavily again in the form factor.

That includes the Samsung Galaxy Z Flip4, which features the Qualcomm Snapdragon applications/baseband processor, 120 Hz main display and touchscreen as well as three mega-pixel cameras.

The following is a partial deep dive into the Samsung Galaxy Z Flip4 smartphone.

Summary

• 6.7 inch AMOLED Y-Octa with touchscreen 2640 x 1080 pixels
• 8 GB mobile LPDDR4 SDRAM
• 10 MP CMOS BSI
• 12 MP CMOS BSI
• Flash LED

Release date: August 2022

Price: $1,059

Availability: Worldwide

Target market: Communications

The main board of the Samsung Galaxy Z phone contains a Qualcomm Snapdragon processor, main memory and power management controllers. Source: TechInsights

Main board

Inside the Samsung Galaxy Z flip phone includes the Samsung multichip memory with 256 GB of 3D TLC V-NAND flash and memory controller. It also includes the Qualcomm octa-core Snapdragon 8+ Gen 1 applications and baseband processor as well as a camera power management device from Samsung. Other electronic components of the smartphone include:

• Texas Instruments’ USB 2.0 repeater
• Maxim’s power management IC
• Qualcomm’s power management, RF antenna tuner and front-end module
• Qorvo’s 5 to 7.2 GHz Wi-Fi front-end module
• Cirrus Logic’s Class-D audio amplifier
• Silicon Mitus’ display power management and battery charger
• Diodes Inc.’s 150 mA LDO regulator

(Learn more about power management ICs on Globalspec.com)

The USB board contains the communications components needed for power and outside control to other devices. Source: TechInsights

USB board

The USB board contains the controls for charging and communication with outside devices. The components found on the board include the MEMS microphone from Knowles, a pair of RF antenna tuners from Qualcomm, a six-axis MEMS accelerometer and gyroscope from ST Microelectronics and a capacitive proximity controller from Semtech.

(Learn more about MEMS devices on Globalspec.com)

The RF board includes the components needed for 5G and millimeter wave communications. Source: TechInsights

RF board

The RF board inside the Samsung Galaxy Z flip phone features the RF transceiver, MB/HB front-end module and 5G new radio front-end module from Qualcomm. Other electronic components include:

• Qorvo’s 5 to 7.2 GHz Wi-Fi front-end module
• Infineon’s 4P4T RF switch and SPDT RF switch
• Murata’s LB RxD front-end module
• Maxscend’s SP4T RF switch

(Learn more about communication ICs on Globalspec.com)

The overall electronic components found inside the Samsung Galaxy Z Flip4 smartphone. Source: TechInsights

Major components

• $128.57 — Octa-core Snapdragon 8+ Gen 1 applications/baseband processor — Qualcomm (Qty: 1)
• $98.40 — 120 Hz main display/touchscreen subsystem — Samsung (Qty: 1)
• $36.86 — 12 MP wide-angle rear camera subsystem (Qty: 1)
• $25.82 — Multichip memory — 256 GB 3D TLC V-NAND flash, memory controller — Samsung (Qty: 1)
• $24.09 — 5G mmWave subsystem — Qualcomm (Qty: 1)
• $18.42 — RF Transceiver + GPS — Qualcomm (Qty: 2)
• $14.51 — 12 MP ultra-wide-angle rear camera subsystem (Qty: 1)
• $13.54 — 10 MP front camera subsystem (Qty: 1)
• $11.77 — MB/HB front-end module — Qualcomm (Qty: 2)