The engineering trend toward aircraft electrification requires conversion of flight control systems from hydraulic to electric to reduce weight and design complexities. Microchip Technology Inc. has introduced a new hybrid power drive module to meet the need for an integrated, configurable power solution for such application.
Available in 12 different variants with either silicon carbide (SiC) mixed oxide semiconductor field-effect transistors or insulated-gate bipolar transistors, these hybrid power drive modules are highly integrated power semiconductor devices that reduce the number of components and simplify the overall system
Source: Microchip Technology Inc. design. The configurable power devices include a three-bridge topology that are available in SiC or Si semiconductor technologies. The compact design features low weight and profile to help reduce the size and weight of electric aircraft.
The modules include auxiliary power devices that facilitate an inrush current limit function. Optional add-on capabilities include soft start, solenoid interface drive, regenerative brake switch and thermal sensors for external monitoring circuitry usage. The power modules also facilitate high-switching frequency power generation, which enables smaller and more efficient systems.
The standard voltage of the power modules ranges from 650 V to 1,200 V, with the option to customize up to 1,700 V on request. The device is designed for low inductances for high-power density with power and signal connectors that are solderable directly on the user’s printed circuit board.
