Vishay’s ThermaWick THJP series of surface-mount thermal jumper chips is now available from New Yorker Electronics. The Vishay Dale thin film device allows designers to transfer heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink while maintaining the electrical isolation of the device.
Featuring an aluminum nitride substrate with high 170 W/m°K thermal conductivity, the Vishay thermal jumper chip is capable of reducing the temperature of connected components by over 25%. This reduction allows designers to increase the power handling capability of these devices or extend their useful life at 
Source: New Yorker Electronicsexisting operating conditions while maintaining the electrical isolation of each component. By protecting adjacent devices from thermal loads, overall circuit reliability is improved.
Low capacitance down to 0.07 pF makes the chip an excellent choice for high frequency and thermal ladder applications. The thermal conductor will be used in power supplies and converters; RF amplifiers; synthesizers; pin and laser diodes; and filters for AMS, industrial and telecommunications applications. The device is available in six case sizes from 0603 to 2512, with custom sizes available. The 0612 and 1225 cases feature long side terminations for additional heat transferring capability. The thermal jumper is available with lead-bearing and lead-free wraparound terminations.
These RoHS-compliant devices are constructed with aluminum nitride substrates thermal ladder and are available in a wide range of connection options including component-to-heat sink, component-to-case, component-to-ground plane, pad-to-pad, pad-to-via and pad-to-trace applications.
