Industrial Electronics

New Vishay Dale thin film wraparound chip resistor released by New Yorker Electronics

14 September 2021

New Yorker Electronics has released the new Vishay Dale PHPA series of thin film wraparound chip resistors. These resistors incorporate self-passivated tantalum nitride film to provide increased moisture resistance as well as improved electrostatic discharge (ESD), voltage coefficient and resistance stability performance. These features allow for high thermal stability within harsh or hazardous environmental conditions.

The AEC-Q200 qualified, Vishay high-power thin film resistor series combines power ratings of 1.0 W and 2.5 W in the 1206 and 2512 case sizes, respectively. They significantly reduce board space and component counts by replacing larger or paralleled resistors. Vishay PHPA resistors are designed with enlarged Source: New Yorker ElectronicsSource: New Yorker Electronicsbackside terminations to reduce the thermal resistance between the topside resistor layer and the solder joint on the end user’s circuit board.

Most thin film chip resistors have a low power capability, and therefore several chips must be used to accommodate higher power applications. In hazardous or unstable environmental conditions, resistors need to be fabricated with resistive materials that can handle the elements. The Vishay thin film series is fabricated with tantalum nitride to offer superior moisture resistance and high thermal stability in harsh conditions. In addition, power capability of the devices far exceeds the industry standard.

The 1206 case size offers a resistance range of 12 Ω to 30.1 Ω while the 2512 supplies a range of 10 Ω to 30.1 Ω. The resistors have an ESD rating of 5A (HBM), a resistor tolerance to ± 0.1% and temperature coefficient of resistance to ±25 ppm/° C. These qualities present new product design advantages such as reduced component count, increased design flexibility with higher power capability, reduced assembly costs and improved board-level reliability.

The resistor’s actual power-handling capability is limited by the end user mounting process. As with any high power chip resistor the ability to remove the generated heat is critical to the overall performance of the device.

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