MEMS and Sensors

MEMS-based ultrasonic ToF sensor platform predicts range up to 5 meters

02 October 2020

TDK has launched a long-range, low-power integrated ultrasonic time-of-flight (ToF) sensor platform for millimeter accurate range measurements and it works in any lighting conditions.

The sensor platform includes the Chirp CH201 microelectromechanical system (MEMS) sensor, sensor modules and developer kits and it can predict range measurements up to 5 meters. The CH201 combines a MEMS ultrasonic transducer with a digital signal processor (DSP) on a low-power mixed-signal application specific integrated circuit (ASIC).

The sensor platform is appropriate for use cases where range finding is needed, or presence/proximity sensing and object-detection/avoidance are critical. The sensor platform works in any lighting condition, from full sunlight to complete darkness, independent of a target’s color and optical transparency.

The developer kit for the CH201 MEMS sensor is designed for prototyping of the sensor and it includes one CH201 sensor with the option to add up to four additional ultrasonic modules. The module included in the platform is used for rapid integration and evaluation hardware designs as well as different acoustic housings to adjust the field of view.

To contact the author of this article, email engineering360editors@globalspec.com


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