Source: Rogers CorporationInnovations in power electronics often rely upon the use of specialty materials. Rogers Corporation, a materials solutions provider, is offering a chance for APEC attendees to have a look at some of them up close. These include laminated busbar solutions and capacitor-busbar assemblies, curamik substrates, 92ML thermally conductive PCB materials and others.
According to the company, the Rolinx line of laminated and powder-coated busbar solutions offers compactness, custom design and low inductance. When used in combination with capacitors in Rolinx CapLink capacitor-busbar assemblies, a solution with high power density and extreme low inductance is created – opening the door to smaller, lighter electronic designs with higher current-handling capacities. Applications range from automotive electronics to solar- and wind-powered systems.
Curamik substrates are created by applying pure copper to a ceramic isolator, resulting in high heat conductivity. The thick copper layer contributes heat capacity and spreading capabilities to the material.
Materials in the 92ML Series reduce the operating temperature of PCB-mounted power ICs, which can reduce both weight and space.
Other materials available from Rogers Corporation include ARLON secure thermal transfer adhesive, a structural adhesive that offers long-term reliability in applications such as power modules, and HeatSORB, a patent-pending phase change material that keeps devices cooler longer by capturing heat and delaying temperature ramps.
Design engineers can also register for access on a design support hub available through the Rogers Power Electronics Solutions group. The free resource contains technical data sheets on materials and a library of technical papers on product and process developments. The company is also developing a video library.
APEC 2019 runs from March 17-21 in Anaheim, California. For more on the conference, visit our dedicated section Electronics360 covers APEC 2019.
