Memory and Storage

Intel and Micron to go Their Separate Ways in 3D Memory Development

16 July 2018

While Intel Corp. and Micron Technology Inc. plan to bring the jointly-developed, second-generation 3D XPoint memory technology to market, after that each company will pursue future technology independently.

The two companies will continue to manufacture memory based on 3D XPoint technology at the Intel-Micron Flash Technologies (IMFT) facility in Lehi, Utah. 3D XPoint technology is an entirely new class of non-volatile memory with lower latency and a greater endurance than NAND flash memory.

The second-generation 3D XPoint is slated for availability in the first half of 2019. Development beyond the second generation of the 3D XPoint technology will be done independently by the two companies in order to optimize the technology for each company’s product and business needs, Intel said.

Intel’s Optane product line is based on the 3D XPoint technology used in client and data center markets.

“Intel Optane's direct connection to the world's most advanced computing platforms is achieving breakthrough results in IT and consumer applications,” said Scott DeBoer, executive vice president of technology development at Micron. “We intend to build on this momentum and extend our leadership with Optane, which combined with our high-density 3D NAND technology offers the best solutions for today's computing and storage needs."

To contact the author of this article, email PBrown@globalspec.com


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