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Tower Pays $7.5 million for Control of Three Panasonic Fabs
Israel specialty foundry is gaining control of three wafer fabs and a five-year order book in return for stock certificates valued at $7.5 million.
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Corning, Atmel Team on Thinner, Curvy Touchscreens
Curved and thinner touchscreens are on their way, courtesy of Corning's Gorilla Glass paired with Atmel's Xsense capacitive touch technology.
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Crossbar Funding Moves ReRAM Closer to Market
A well-connected startup commercializing resistive RAM research out of the University of Michigan has raised $25 million and is in talks with potential users of its technology.
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Startup Halves 28nm SRAM Power Consumption
Lower power SRAMs through better sense and control circuitry confirmed in 28nm silicon by IP licensing startup.
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Lenovo Recalls ThinkPad Battery Packs
Battery packs sold with some models of ThinkPad notebook computers in the U.S. and Canada can overheat and cause fire, according to a U.S. government agency.
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Telekom Malaysia Re-Enters Mobile Market, But Faces Considerable Challenges
Telekom Malaysia's deal to acquire a 57 percent stake in Malaysia's largest WiMAX provider carries significant risks.
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Future Signs Deal with Crocus; Digi-Key to Carry Active-Semi Products
Future will distribute Crocus's magnetically enhanced semiconductors, while Digikey will carry Active-Semi's line of analog and mixed-signal power ICs.
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Kalray Eyes FDSOI for Many Core Processors
A European startup that has a developed a massively parallel processor is being asked to move the architecture on to ST’s fully-depleted silicon-on-insulator manufacturing process.
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Quantum Recruits Silvaco to Model Si-Ge-C Superlattices
A research company founded by experienced academics and semiconductor executives has moved closer to getting SiGeC superlattice structures into commercial use with potential consequences for sensors.
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Future to Sell Cymbet Solid-State Batteries
Canadian distributor to carry Cymbet's entire family of EnerChip smart solid-state batteries and power management solutions in the Americas.
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Intel, Altera Go 3D With Multi-die Packaging
Intel will package heterogeneous multi-die components for Altera as part of a foundry service agreement.
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T&M Vendors Likely Winners in Wireless Module Race
Test and measurement equipment vendors see the wireless module test market as lucrative, and for them, immune to typical market pressures.
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Wearables to Add $70 Million to Battery Sales by 2018
A surge in the sales of wearable equipment is set to drive a major increase in the lithium battery market according to a market research report.
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450mm Wafer Consortium Appoints TSMC Exec as Leader
An award-winning TSMC executive has been appointed to manage the wafer consortium responsible for an industry transition to production on 450mm diameter wafers.
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Cisco Backs Smart-Grid Modem Startup
Fabless chip startup EnVerv already has a soft-modem IC on the market and some traction with customers, which eased the closing of its Series C round of venture capital.
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Wolfson Adds Zoomable Audio to Hub ICs
Wolfson Microelectronics likes the sound of AudioFrame technology from Los Angeles based Audyssey.
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Altera to Accelerate IBM POWER-Based Data Centers
The OpenPOWER Foundation, which aims to proliferate IBM's POWER processor architecture within data centers, is gaining supporters, the latest being Altera.
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Chaotic Startup Offers Secure Hardware Option
The chaos inherent within some non-linear mathematics will have a part to play in digital cryptography according to a startup that has been nurturing its technology for nearly a decade.
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Diamond Wire Transmits Data Via Spin Electronics
In a possible breakthrough for quantum computing, university researchers used spin electronics to transmit signals down a diamond wire.
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Many Core Processor Serves as HEVC 4K Encoder
French fabless chip company demonstrates 256-core processor applied to HEVC encode of 4K-resolution video stream.
