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Industries
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Danisense achieves full ISO/IEC 17025 accreditation for AC calibration services
The in-house laboratory is now fully accredited for AC and DC calibration.
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Compact high-density digitizers for scalable systems
These digitizers deliver 10 bit vertical resolution and high sampling rates suited for fast detector signals and measurement environments.
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Efficiency you can measure
Precise temperature, humidity and other sensors engineered for data centers and the food industry will be on display by E+E Elektronik at MCE 2026 in Milan, Italy.
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Absolutely APEC 2026 (March 22-26)
APEC has quickly become one of the pre-eminent events on the electronics industry calendar. Our electronics lead editor, Peter Brown, will attend to gather insights, spot trends and report on key developments.
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Broadcom unveils 400 G/lan optical DSP
Called Taurus, the device is considered an industry first.
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Starlink, Deutsche Telekom to expand SATCOM collaboration
The deal will expand the telecom’s coverage to hard-to-reach areas.
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PEI-Genesis celebrates 80 years of engineered connector solutions
Through strategic acquisitions, product expansion and a deep passion for emerging technologies, the company steadily grew since 1946 alongside the evolving electronics industry.
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MWC 2026: Intel, Ericsson push AI-native 6G deployments
The collaboration will seek to move 6G from the research phase to eventual deployment.
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ChicGrasp robotic system reshapes poultry processing automation
Originally developed in response to labor shortages in poultry processing plants amid the COVID-19 pandemic, the ChicGrasp is now a robotics system capable of learning by imitating human movements to handle chickens using an imitation learning algorithm and camera perceptions.
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Hitachi Energy and Pakal Technologies join forces in breakthrough silicon power semiconductor for high-voltage modules
The next-generation 3.3 kV power modules are critical to advance rail, renewables, energy storage, artificial intelligence and data center infrastructure.
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GOWIN Semiconductor announces new FPGA families for 2026
New capabilities allow designers to reduce external components, simplify system architecture and optimize board-level efficiency.
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Innodisk showcases integrated edge AI portfolio for industrial deployment at Embedded World 2026
The company will highlight advanced computing performance with practical system integration to enable scalable, secure and high-efficiency edge artificial intelligence (AI) implementation.
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Dymax to demonstrate light-curing technologies for electronics assembly at the APEX EXPO 2026
The company will present UV/LED light-curable solutions developed for electronics assembly and printed circuit board manufacturing.
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Pleora launches eBUS SDK 7.0, delivering a unified, high-performance platform for next-generation imaging systems
The imaging system provides a powerful, standards-compliant foundation for GigE Vision and USB3 Vision connectivity across Windows, Linux and embedded operating systems.
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SWI6 and SMI6 series deliver ultra-efficient, globally compatible 6 W power solutions
They feature ultra-low no-load power consumption (less than 0.1 W), which lowers operating temperatures, extends adapter life, improves system reliability and reduces total costs.
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Tiny ‘electronic dolphin’ robot, no bigger than a sneaker, targets oil spills
The minibot, dubbed the "Electronic Dolphin," is, as its name suggests, shaped like a dolphin and roughly the size of a sneaker.
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Nordic Semiconductor expands nRF54L series with entry-level Bluetooth LE SoCs
The series has expanded to cover a wider range of applications, including cost-sensitive Bluetooth LE products.
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Self-sufficient modular robots flip, jump and function even when split apart
Made up of autonomous, Lego-like modules, each component of the legged metamachines features its own circuit board, battery and motor.
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Hyundai unveils firefighting robot that can endure 1,472° F heat
Hyundai Motor Company, in collaboration with Kia, Hyundai Rotem, Hyundai Mobis and the National Fire Agency, created its Unmanned Firefighting Robot to help protect human firefighters from the risks they face on the job.
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Rohde & Schwarz and Realtek demonstrate first test solution for Bluetooth LE High Data Throughput (HDT)
The companies have successfully validated the industry’s first test solution for the upcoming Bluetooth LE High Data Throughput (HDT) feature.
