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Industries
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Amphenol Printed Circuits shows PCBs for quantum computing at 2026 APS
The company will highlight its extensive capabilities in rigid, flexible and rigid-flex printed circuit boards (PCBs), with a focus on high-density multilayer flex for quantum.
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Taoglas debuts ‘world-first’ AI-powered antenna selection platform at Embedded World 2026
The platform enables engineers and non-technical decision-makers to quickly move from a blank slate to a validated antenna shortlist in minutes.
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Excelitas to showcase humm3 Flashlamp System at JEC World
Attendees will experience how humm3 enables high intensity photothermal processing with precise power control and uniform energy delivery.
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US firm introduces high-thrust underwater vehicle capable of 30-day missions
The vehicle, dubbed the Momentum Electric ROV, which can reportedly deliver extended support for drilling, inspection, maintenance and repair (IMR), surveys and construction work scopes, features plug-and-play sensors, 360° vision, automation, strong thrust and high payload capacity.
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Future Electronics and SnapMagic announce CAD model integration to support faster design cycles
Engineers can now download verified symbols, footprints and 3D models directly from supported product pages, enabling a smoother transition from component selection to PCB layout.
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TDK presents embedded solutions for next generation applications at Embedded World 2026
Technologies ranging from sensor solutions, power supplies and embedded motor controllers to flash storage solutions and microphones.
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Emerson launches new software defined radio for radar, satellite and 6G research
The device combines 20-gigahertz frequency range and phase-coherent, multi-channel architecture to accelerate next-generation radio frequency (RF) innovation.
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TASKING unveils industry’s first end-to-end compile, debug and test toolchain for Renesas RH850 microcontrollers, including new RH850/U2C series
With its new RH850-supported compiler, TASKING now provides a seamless environment that enables truly holistic development for automotive and industrial engineers.
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Aetina launches AIP-FR68S edge AI workstation at Embedded World 2026
The enterprise-grade "CXO Solution" artificial intelligence (AI) agent system enables users to achieve C-suite-level automated decision-making capabilities while ensuring complete data privacy in edge environments.
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From chiller to chip: GF and Rittal deliver full-scope polymer cooling infrastructure for next-generation data centers
GF and Rittal have collaborated to deliver a fully integrated cooling solution for NETMOUNTAINS' new co-location data center in Velbert, Germany.
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Tiny robot will inspect 17-mile pipe network in the world’s most powerful particle collider
The “PipelNEER” is a small inspection device capable of inspecting beamline pipes in the Large Hadron Collider (LHC), otherwise known as the world’s most powerful particle accelerator, at CERN.
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KT and Rohde & Schwarz to showcase AI-enhanced radio transmission performance
In a joint 6G AI proof-of-concept demonstration, the CMX500 one-box tester from Rohde & Schwarz shows significant downlink throughput gain in an AI-based wireless transmission compared to conventional non-AI technology.
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Nordic Semiconductor accelerates cellular IoT leadership with major new product releases at MWC 2026
The next-generation portfolio features Cat 1 bis, satellite non-terrestrial network (NTN), advanced LTE-M/NB-internet of things (IoT) with edge artificial intelligence and a clear path to 5G eRedCap delivering secure and resilient connectivity across billions of IoT devices.
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TEC 6UI series: Compact 6 Watt DC/DC converters with an ultra-wide 8:1 input
These next-generation converters are engineered to seamlessly replace and serve as an alternative to existing 2:1 and 4:1 input converter series.
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ROHM and Suchi Semicon establish a strategic semiconductor manufacturing partnership in India for global and domestic market
The companies aim to build a reliable and scalable manufacturing framework aligned with evolving industry needs.
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Rohde & Schwarz demonstrates FR1–FR3 carrier aggregation, advancing 6G readiness
Mobile World Congress Barcelona attendees can experience a live demonstration that aggregates a mid-band channel around 2.5 GHz (FR1) with an upper mid-band channel around 7 GHz (FR3), using 4x4 MIMO on both bands and higher-order modulation.
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Nordic Semiconductor releases reference design for Aliro and Matter-based access control systems
The complete reference design is now available to accelerate the development of next-generation access solutions.
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United Semiconductors taps Starlab to scale chip crystal growth in space
The company will look to move from demonstrations to commercial-scale, in-space production of materials for semiconductors.
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Smart glasses could drive the next wave of engineered substrates
“Bulk silicon is no longer enough. You need substrates with superpowers.”
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Menlo Micro and Purdue University advance commercial cryogenic switching for scalable quantum computing
The research demonstrates a commercial-ready architecture for quantum control and readout electronics at cryogenic temperatures.
