Industries
-
Vishay Intertechnology upgrades TFBS4xx and TFDU4xx Series IR transceiver modules with longer link distance and improved ESD robustness
Offering drop-in replacements for existing solutions, the IrDA-compliant devices feature new in-house IC and surface emitter chip technology.
-
Mitsubishi Electric and Dispel to expand operational technology security business
Factory automation equipment and operational technology security solutions will be integrated with secure remote-access technology.
-
Curtiss Wright introduces its rugged mission computer with cyber security for small-form-factor airborne applications
The Parvus DuraCOR 8044 Modular Mission Computer Workstation features a sealed and fanless IP67-compliant design that enables system designers to meet compute-intensive requirements for applications deployed in the harshest environments.
-
Rohde & Schwarz hosts next edition of popular Oscilloscope Days event in April 2024
Eight online workshop sessions will provide insights into different day-to-day testing challenges that electronic design engineers face when using oscilloscopes.
-
New analog chip architecture delivers 10x energy efficiency
The chips could be used in AI or ML in the future.
-
Datakey RUGGEDrive line expands with industrial UFX models
This series of RUGGEDrive memory tokens provides USB flash drive functionality with industrial temperature operation and optional pSLC NAND flash.
-
The 10 EVs consumers want most in 2024
The Volkswagen ID. Buzz tops the list according to Rerev.com analysis.
-
Waymo begins Los Angeles robotaxi testing today
It will be the first public testing after private testing started last year.
-
A look at semiconductor manufacturing, testing and packaging
The three primary steps in making semiconductors are making the wafer, building the circuit and packaging them.
-
OFC 2024: Broadcom expands optical interconnect portfolio
The new devices are aimed at AI and machine learning applications.
-
Vishay Intertechnology 80 V symmetric dual MOSFET delivers best in class RDS(ON) in PowerPAIR 3x3FS to increase power density, efficiency and thermal performance
This space-saving device increases power density and efficiency while enhancing thermal performance, reducing component counts and simplifying designs.
-
Delta showcases innovative wireless charging solutions and machine vision solutions for smart logistics at MODEX 2024
High-efficiency wireless charging systems and smart industrial automation solutions for AGVs, e-forklifts and conveyors to foster autonomous logistics operations are featured.
-
Startup receives FAA clearance to fly swarm drones with 1 pilot
Hylio can swarm 55 lb drones without visual observers.
-
Rohde & Schwarz introduces dedicated phase noise analysis and VCO measurements up to 50 GHz with the R&S FSPN50
The instrument provides both high speed measurements and also accuracy for characterizing sources such as synthesizers and voltage-controlled oscillators (VCOs).
-
Ultrasonic sensors provide easy and flexible use
With an adjustable sound cone and small dead zone, new Leuze ultrasonic sensors can be used for many different applications.
-
Visit Alliance Memory at Embedded World 2024
New LPDDR4x, eMMC, Flash, SDRAM and lower power SRAM solutions will be displayed.
-
IDS is the first industrial camera manufacturer to offer the Sony sensor IMX662 in both color and mono
Designed for maximum light sensitivity, these sensors are now available either as compact uEye+ XCP models or as board-level versions in the uEye+ XLS series.
-
RoboDK and Comau partner to offer improved robotic simulation and offline programming
The latest version of Comau Roboshop Next Gen software now seamlessly integrates with RoboDK, making simulation more advanced.
-
Rohde & Schwarz at EMV 2024: Outstanding T&M solutions from the market leader in EMC
A comprehensive range of electromagnetic compatibility (EMC) test and measurement solutions — ranging from standalone instruments and software to application-specific systems — will be on display.
-
Electronics in agriculture
A more resilient and sustainable future for global food production is within reach due to the marriage of electronics with agriculture, which includes innovations such as precision farming and the internet of things.
