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Vishay Intertechnology adds pick and place friendly SMD lead bending option for AC05 and AC05-AT 5 W cemented, axial-leaded wirewound resistors
The WSZ lead form allows devices to bed used as surface-mount device components to reduce assembly costs.
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ODU turns testing to excellence at ATE Europe
The company will present precise connectors for mating and docking for a range of demanding automotive test and measurement applications.
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Smartphone market to rebound in 2024
Android growth in emerging markets will fuel recovery.
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BenQ Group at 2024 COMPUTEX Taipei
The BenQ Group seeks to enhance the sustainability of the 2024 COMPUTEX event in Taipei.
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Global tracking and telematics Click board from MikroE has extensive network compatibility
The u-blox module supports 14 LTE bands, four GSM/GPRS bands and integrated GNSS for precise global tracking.
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Lilium to sell 4 air taxis to UK helicopter vendor
The agreement also includes a reservation for an additional 12 aircraft.
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AI chip revenue to hit $71 billion this year
The growth will be driven by demand for generative AI in data centers.
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AEWIN amazes COMPUTEX2024 with AI-powered cybersecurity
The company will present high performance computing servers and network appliances for smart cybersecurity, edge artificial intelligence and internet of things applications.
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NHTSA investigating Waymo over robotaxi accidents
It is the third autonomous vehicle vendor to come under investigation recently.
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T-Mobile expands 5G network with UScellular acquisition
The deal will reach millions of users in rural areas.
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Rock salt could lead to cheaper, greener EV batteries
It could also lead to significant environmental impacts.
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Video: This headphone AI can block ambient noise to improve focus
A new University of Washington system cancels all other sounds to focus on the voice of a specific person.
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An intro to the instrumentation amplifier
This specialized type of amplifier is designed to address the challenges of amplifying weak signals from sensors in noisy environments.
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Revolutionary flip-chip die bonder from ITEC is 5X faster than current market leaders
The system runs five times faster than existing machines, attaching up to 60,000 flip-chip dies per hour.
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Rohde & Schwarz presents its solutions for next generation wide bandgap device test and debug at PCIM Europe
Attendees will experience cutting-edge test solutions for power electronics under the motto “Moving to next-generation wide bandgap device testing & debugging.”
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Webinar: How to test GaN and SiC MOSFET and IGBT devices
Learn how to use benchtop test instruments to effectively (and safely) analyze circuits in a qualitative and quantitative manner.
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Vehicle-to-Anything (June 9-15)
It's not vehicle-to-everything; it's vehicle-to-anything.
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This camera platform is an imaging speed demon
The single-shot device can capture up to 156 trillion frames per second.
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Ericsson expands 5G smart factory in Texas
The networking vendor will invest an additional $50 million to accelerate the manufacturing of local 5G infrastructure.
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Belden launches new solutions to support robust and reliable communications
Releases include fire alarm cables from Belden, Hirschmann IT railway radios and managed switches, and ProSoft routers.
