The iPhone 7 Plus improves on aspects of the iPhone experience. It introduces advanced new camera systems and an increase in battery life. Other features include immersive stereo speakers; a bright, colorful display; and splash and water resistance.
iPhone 7 Plus
Summary points:
The Apple iPhone 7 Plus is equipped with:
- Apple Application Processor, 64-bit dual-core, 14nm A10/APL1W24
- 32GB NAND and 3GB LPDDR4 SDRAM
- Intel Baseband, 20nm, PMB9943
- 5.5" IPS LCD Display, In-Cell Touch w/3-D Touch, 1920 × 1080
- Target market: Mass Market
- Released: September 2016
- Pricing: USD $769
- Availability: Global
- Total cost (direct materials and manufacturing): $277.66 USD
Major Components:
- 5.5" Diagonal, TFT LCD, LTPS, IPS, 1920 × 1080, In-Cell Touch, Integrated Touchscreen Controller Module, Integrated 3-D Touch Controller & PCB - MFG: JAPAN DISPLAY INC. (Qty: 1)
- Enclosure, Main, Bottom, Machined Aluminum, Anodized, 2-Pieces, w/Injection Molded Plastic, w/34-Spot Welded Points & 16 Pressed-In Threaded Metal Inserts & 31 Metal Tabs, Printed (Qty: 1)
- Apps Processor, 64-Bit Quad-Core ARM CPU, Hexa-Core GPU, 16nm, PoP - MFG: APPLE INC. - MPN: APL1W24 (Qty: 1)
- Primary Camera Module, Dual, 12MP, BSI CMOS, Auto-Focus Lens, Optical Image Stabilization, Wide Angle 6P Lens & Telephoto 5P Lens (Qty: 1)
- SDRAM, Mobile DDR4, 3GB, PoP - MFG: SAMSUNG SEMICONDUCTOR INC - MPN: K3RG4G40MM-YGCH (Qty: 1)
- Baseband Processor, Multi-Mode, Multi-Band - MFG: INTEL CORP. - MPN: PMB9943 (Qty: 1)
- 10-Layer, FR4/RCF HDI, Any Layer Stacked Via, Lead-Free - MFG: COMPEQ MANUFACTURING CO. LTD. (Qty: 1)
- BT / WLAN Module, Contains Broadcom BCM4355M3KWBC, Contains Skyworks PAs & LNAs, IEEE 802.11 a/b/g/n/ac, Bluetooth V4.2 - MFG: UNIVERSAL SCIENTIFIC INDUSTRIAL CO. LTD - MPN: 339S00201 (Qty: 1)
- Flash, NAND, 32GB, MLC - MFG: SK HYNIX INC - MPN: H23QEG8VG2ACS-BC (Qty: 1)
- RF Transceiver, Multi-Mode, Multi-Band - MFG: INTEL CORP. - MPN: PMB5750 (Qty: 2)
iPhone 7 Plus main PCB bottom 