Acquired Electronics360

Audio and Video

Samsung Introduces First Mobile Application Processor Designed for Wearables

11 October 2016

Samsung Electronics has just announced the mass production of the Exynos 7 Dual 7270 – the first mobile application processor (AP) designed specifically for wearable devices. The processor is equipped with 14-nanometer (nm) FinFET process technology and features full connectivity and LTE modem integration.

Samsung reveals the Exynos 7 Dual 7270. (Image Credit: Samsung)Samsung reveals the Exynos 7 Dual 7270. (Image Credit: Samsung)

Over the last year, Samsung has been expanding the adoption of 14nm technology for a variety of products such as smartphones and entry-level mobile devices. The Exynos 7270 introduces the application of the technology to wearables too.

“The Exynos 7270 presents a new paradigm for system-on-chips (SoC) dedicated to wearables,” said Ben K. Hur, Vice President of System LSI Marketing at Samsung Electronics. “Designed on our state-of-the-art process technology, this AP offers great power savings, 4G LTE modem and full connectivity solution integration, as well as innovative packaging technology optimized for wearable devices. It is a ground-breaking solution that will greatly accelerate wider adoption of wearable devices by overcoming limitations in current solutions such as energy usage and design flexibility.”

The Exynos 7270 is powered by two Cortex®-A53 cores and makes full use of the 14-nm process, delivering 20% improvement in power efficiency when compared to its predecessor built on 28 nm, and as result, extending the battery life.

By integrating Cat.4 LTE 2CA modem, the new AP allows wearables to connect to a cellular service as a stand-alone device. It also allows for tethering and data transfer between thanks to its embedded Wi-Fi and Bluetooth connectivity. In addition, integrated connectivity capabilities support FM (frequency modulation) radio, and location-based services with GNSS (global navigation satellite system) solutions.

A reference platform comprised of the Exynos 7270, NFC (near field communication) and various sensors is currently available for device manufacturers and customers.

To contact the author of this article, email [email protected]

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter


Date Event Location
18-22 Jun 2018 Honolulu, Hawaii
12-16 Aug 2018 Vancouver, Canada
11-13 Sep 2018 Novi, Michigan
27 Sep 2018 The Reef, Los Angeles
26 Oct 2018 Old Billingsgate
Find Free Electronics Datasheets