Consumer Electronics

Teardown: Xiaomi Mi Pad 2

01 October 2016
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

The Mi Pad 2 is Xiaomi's second-generation Mi Pad. Instead of its original Nvidia Tegra ARM chipset, the creators opted to use Intel's Atom X5 Z8500 and 2GB of RAM. The Mi Pad 2 comes in two versions: an Android 5.1 MIUI 7 with 16GB or 64GB, and a Windows 10 version with 64GB of storage. It also comes equipped with a full metal casing that is only 6.9 mm thin and weighs 333 grams.

Summary Points

Target market: General Consumer

Released: July 2016

Pricing: $255 USD

Availability: Global

Total cost (direct materials and manufacturing): $136.18

Major Components:

  • 7.9" Diagonal, TFT LCD, IGZO, IPS, 2048 x 1536, N/T, 68g - MFG: SHARP CORP. - MPN: LQ079L1SX01 - (Qty: 1)
  • CPU, Intel Atom X5-Z8500 Processor, Quad-Core, 2.24GHz, 2MB L2 Cache, Integrated Intel HD Graphics, 14 nm Process - MFG: INTEL CORP. - MPN: FJ8066401715842 - (Qty: 1)
  • 7.9" Diagonal, G2 Type, Direct Bonding, with Tempered Cover Glass, with Integral Flex PCB - MFG: BIEL CRYSTAL MANUFACTORY LIMITED - (Qty: 1)
  • SDRAM, Mobile DDR3, 1GB - MFG: MICRON TECHNOLOGY INC - MPN: EDF8164A3MA-GD-F - (Qty: 2)
  • Enclosure, Main, Top, Die-Cast Magnesium Alloy, Machined, with Injection-Molded Glass-Filled Polycarbonate Frame, with 13 Metal Tabs, with 2 Pressed-In Threaded Brass Inserts - (Qty: 1)
  • Battery Pack, Li-Polymer, 2-Cell, 3.84V, 6010mAh, 23.08Wh, with Integral Flex PCB & Board-to-Board Connector - MFG: SCUD (FUJIAN) ELECTRONICS - (Qty: 1)
  • Enclosure, Main, Bottom, Die-Cast Aluminum, Machined, Anodized, Printed - (Qty: 1)
  • 10-Layer, FR4/RCF HDI, 3+4+3, Lead-Free - MFG: UNIMICRON TECHNOLOGY CORP. - (Qty: 1)
  • Primary Camera Module, 8MP, BSI CMOS, 1/4" Format, Auto Focus Lens, 5P Lens - MFG: O-FILM TECH CO. LTD. - (Qty: 1)
  • Flash, eMMC NAND, 16GB, MLC - MFG: SAMSUNG SEMICONDUCTOR INC. - MPN: KLMAG2GEND-B031 - (Qty: 1)

Mi Pad ComponentsMi Pad Components



Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement