Semiconductors and Components

Semiconductor Equipment Spending to Rebound in 2017

13 July 2016

While spending worldwide on semiconductor capital equipment will be flat this year, the market will rebound to reach double-digit growth in 2017, according to the trade group SEMI.

SEMI forecasts capital equipment spending will grow only 1% this year, reaching $36.9 billion, which is an improvement over a 3% decline last year. The better news is that in 2017, capital equipment spending will increase 11% to $41.1 billion.

Spending on semiconductor capital equipment is expected to accelerate for the remainder of 2016 and take off in 2017. Source: SEMI   Spending on semiconductor capital equipment is expected to accelerate for the remainder of 2016 and take off in 2017. Source: SEMI “After a tepid 2015, device manufacturers are beginning to ramp their investments in key industry segments,” says Denny McGuirk, president and CEO of SEMI. “We expect capital spending to improve for the remainder of 2016 and into 2017.”

Spending on capital equipment was slow at the beginning of the year, but it is expected to accelerate in the second half and continue into 2017 driven by foundries, memory (both 3-D NAND and DRAM), MPU, power management and investments in China, SEMI says.

Taiwan is forecast to continue to be the leader in equipment spending this year with $9.5 billion and $10 billion in 2017. China will be the second-largest spender in 2016 with $6.4 billion, followed by Korea with $6.2 billion. However Korea is forecast to overtake China in spending next year while Taiwan remains in the top spot, SEMI says.

For 2016, front-end wafer processing equipment is forecast to grow 2% to $29.3 billion, up from $28.8 billion last year. Test equipment spending will be flat in 2016 compared to last year, totaling $3.4 billion. Assembly and packaging equipment and other front-end equipment will contract in 2016, falling to $2.4 billion, or negative 5%, and $1.9 billion, or negative 2%, respectively.

To contact the author of this article, email engineering360editors@ihs.com

To contact the author of this article, email PBrown@globalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement