Semiconductor Value Chain

Firms Collaborate to Bring IoT Platform to Chinese Chip Vendors

03 June 2015

Chinese ASIC design startup Brite Semiconductor is developing an Internet of Things (IoT) platform in collaboration with Semiconductor Manufacturing International Corp. (SMIC).

The IoT platform is targeted at supporting semiconductor companies looking to become involved in China’s emerging smart devices and cloud infrastructure. The platform is based on SMIC’s 55nm low-leakage and ultra-low power process that includes embedded flash (eFlash) memory. Brite says the design platform will reduce operating voltages to lower both active power and standby power consumption, which is important when developing IoT devices for smart home and wearable products.

Also collaborating in the IoT ASIC platform is digital signal processing (DSP) intellectual property (IP) supplier CEVA, which is offering up its Bluetooth IP to be coupled with a controller software stack in the design. The CEVA IP can be used to enable applications such as voice activation, speech recognition, sensor fusion, face detection and fingerprint recognition in IoT products.

Brite’s platform is one of many that has emerged to compete in the IoT space including the recent announcement from Fujitsu, Samsung’s Artik development platform and Intel’s reference model to enable secure and easy IoT designs.

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