Overview / Main Features
The HP Pavilion DM3T is the Intel-equipped version of HP's DM3 series of entertainment notebook computers. The aluminum brushed finish laptop features a LED backlit 13.3-inch and a 6 cell lithium ion battery for extended portable use. Inside, the DM3T features an Intel Mobile Core 2 Duo processor (SU7300, 1.3GHz) and companion Intel GS45 chipset featuring Intel Graphics Media Accelerator 4500MHD. This particular model comes configured with 2GB of SO-DIMM memory, 320GB disk space and an 802.11n-capable WLAN module.
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ULV computing / light-weight notebook
Released
Q4 2009
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Pricing - The HP Pavilion DM3T [with specific configurations listed here] sells for $750 direct from HP.com
Availability - North America (assumed)
Volume Estimations
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
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Major Cost Drivers (Representing ~85% of Total Direct Materials Costs)
Intel - AV80577UG0133ML - CPU - Intel Core 2 Duo Mobile Processor, 1.3GHz, 3M Cache, 800MHz FSB, 45nm Process
AU Optronics - B133XW01 - Display Module Value Line Item - 13.3' TFT LED Backlit LCD, 262K Color, 1366 x 768 Pixels, 0.216mm x 0.216mm Pixel Size, 293.4mm x 165.0mm Viewable Area, 220cd/m^2, 500:1 Contrast Ratio, 8ms Response Time
Seagate - ST9320325AS - Hard Drive - 320GB, 2.5', 5400rpm, SATA, 3Gb/s, 8MB Buffer
Battery - Li-Ion, 11.1V, 57Wh
Samsung Semiconductor - M471B2873EH1-CF8 - SODIMM DDR3 - 1GB, 128Mx64, 1066MHz (Qty:2)
Intel - AC82GS45-SLB92 - Northbridge / Graphics - Mobile Intel GS45 Memory Controller and Graphics Hub, 65nm Process
Atheros - AR5BHB92 - WLAN Half Mini PCIe Module Value Line Item - 802.11a/b/g/n
Tripod Technology - 8-Layer - FR4
Intel - AM82801IUX-SLB8N - Southbridge - I/O Controller Hub(Intel ICH9M-SFF)
Enclosure, Main, Bottom - Die-Cast Magnesium, Painted, Printed
Webcam PCB - Contains VGA Image Sensor, Novatek Camera Controller, Knowles Acoustics Silicon Microphone & Supporting Elements
Materials and Manufacturing $526.53
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What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
Manufacturing Notes
OEM/ODM/EMS Relationships / Manufacturing
Per iSuppli's own Global OEM Manufacturing and Design Analysis (GOMDA) report, HP outsources nearly 100% of its mobile PC manufacturing to EMS providers and ODMs. Specifically, this custom configured DM3T was shipped directly from Flextronics.
Country of Origin / Volume Assumptions
Based on markings, the HP Pavilion notebook computer was manufactured in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as SO-DIMM modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pin count of the device. This calculation is affected by country or region of origin as well.
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Design for Manufacturing / Device Complexity
The HP Pavilion DM3T has a component count of 1832, of which, 378 are mechanical in nature. Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Design Notes
Here is a summary of the major subsystems and components in the HP Pavilion DM3T design:
Motherboard
CPU
- Intel - AV80577UG0133ML - Core 2 Duo Mobile Processor, 1.3GHz, 3M Cache, 800MHz FSB, 45nm Process
Chipset
- Northbridge - Intel - AC82GS45-SLB92, Mobile Intel GS45 Memory Controller and Graphics Hub, 65nm Process
- Southbridge - Intel - AM82801IUX-SLB8N, I/O Controller Hub(Intel ICH9M-SFF)
I/O & Interface
- I/O Controller - iTE -IT8502E, Super I/O Device, LPC Interface
- Audio Codec - IDT - 92HD81B1C5NLGX, 4-Channel, w/ 4 Stereo Speaker Amplifiers & 2 Capless Headphone Amplifier, w/ LDO Regulator
- Ethernet Controller - Realtek - RTL8103EL-GR, 10/100Base-T, PCI Express 1.1
- Level Shifter - Parade Technologies - PS8101, 1-to-1 HDMI / DVI
Display
- Display Module - AU Optronics - B133XW01
Memory
- SODIMM Module -Samsung Semiconductor -M471B2873EH1-CF8, DDR3 - 1GB, 128Mx64, 1066MHz, Qty. 2
Storage
- Hard Drive - Seagate -ST9320325AS, 320GB, 2.5', 5400rpm, SATA, 3Gb/s, 8MB Buffer
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