Overview / Main Features
The HP Pavilion DM3Z is the AMD-equipped version of HP's DM3 series of entertainment notebook computers. The aluminum brushed finish laptop features a LED backlit 13.3-inch and a 6 cell lithium ion battery for extended portable use. Inside, the DM3Z features an AMD Turion Neo X2 processor (L625, 1.6GHz) and companion AMD chipset featuring ATI Radeon HD 3200 graphics. This particular model comes configured with 2GB of SO-DIMM memory, 320GB disk space and an 802.11n-capable WLAN module.
ULV computing / light-weight notebook
Pricing - The HP Pavilion DM3Z [with specific configurations listed here] sells for $650 direct from HP.com
Availability - North America (assumed)
For the purposes of this teardown analysis, we have assumed a lifetime production volume of 1M units.
As a reminder, teardown volume production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Major Cost Drivers (Representing ~80% of Total Direct Materials Costs)
Toshiba Storage Device - MK3263GSX - Hard Drive - 320GB, 2.5', 5400rpm, SATA II, 3Gb/s, 8MB Buffer
LG Display - LP133WH2 - Display Module Value Line Item - 13.3' TFT LED Backlit LCD, 262K Color, 1366 x 768 Pixels, 0.2148mm x .2148mm Pixel Size, 293.4mm x 165.0mm Viewable Area, 220cd/m^2, 500:1 Contrast Ratio, 16ms Response Time
AMD - TMZL625OAX5DY - CPU - Turion Neo X2 1.6GHz, 1MB L2 Cache, 65nm
Battery - Li-Ion, 11.1V, 57Wh
Netlist - NL8256421207F-D64NEF - SODIMM DDR2 - 2GB, 256Mx64, 800MHz
AMD - RS780MN - Northbridge - Graphics and Memory Controller Hub
Atheros - AR5BHB92 - WLAN Half Mini PCIe Module Value Line Item - 802.11a/b/g/n
UniMicron Technology - 6-Layer - FR4
AMD - SB710 - Southbridge - I/O Controller Hub
Webcam PCB - Contains VGA Image Sensor, Novatek Camera Controller, Knowles Acoustics Silicon Microphone & Supporting Elements
Materials and Manufacturing $399.49
What Is Not Included in our Cost Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
OEM/ODM/EMS Relationships / Manufacturing
Per iSuppli's own Global OEM Manufacturing and Design Analysis (GOMDA) report, HP outsources nearly 100% of its mobile PC manufacturing to EMS providers and ODMs. Specifically, this custom configured DM3Z was shipped directly from Flextronics.
Country of Origin / Volume Assumptions
Based on markings, the HP Pavilion notebook computer was manufactured in China. Furthermore, we have assumed that custom mechanicals (plastics, metals, etc.) were sourced in China.
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as SO-DIMM modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Remember also that labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pin count of the device. This calculation is affected by country or region of origin as well.
Design for Manufacturing / Device Complexity
The HP Pavilion DM3Z has a component count of 1762, of which, 392 are mechanical in nature. Component counts have a direct bearing on the overall manufacturing cycle times and costs, and also can increase or decrease overall yields and re-work. Our calculations of manufacturing costs factor counts and more qualitative complexities in the design.
Note that manual labor has a much smaller effect on auto-insertion assembly lines (for the Main PCB, for example), where manufacturing costs are much more capital equipment intensive and driven by these investment costs.
Here is a summary of the major subsystems and components in the HP Pavilion DM3Z design:
- AMD - TMZL625OAX5DY - Turion Neo X2 1.6GHz, 1MB L2 Cache, 65nm
- Northbridge - AMD - RS780MN Graphics and Memory Controller Hub
- Southbridge - AMD - SB710 I/O Controller Hub
I/O & Interface
- Motion Sensor / Accelerometer - ST Microelectronics - LIS302DL, MEMS, 3-Axis, +-2g/8g, Digital Output
- I/O Controller - iTE - IT8502E, Super I/O Device, LPC Interface
- Audio Codec - IDT - 92HD81B1C5NLGX, 4-Channel, w/ 4 Stereo Speaker Amplifiers & 2 Capless Headphone Amplifier, w/ LDO Regulator
- Ethernet Controller - Realtek - RTL8103EL-GR, 10/100Base-T, PCI Express 1.1
- Display Module - LG Display - LP133WH2
- SODIMM DDR2 - Netlist - NL8256421207F-D64NEF
- Hard Drive - Toshiba Storage Device - MK3263GSX (320GB, 2.5', 5400rpm, SATA II, 3Gb/s, 8MB Buffer)