- Display: 20' LED Backlit IPS Touch Display
- CPU: Intel Core i7-3517U Processor, Dual Cores, 1.9GHz
- Chipset: HM76 Express Chipset
- Memory: 2 x Nanya 4GB DDR3-1333 DIMM
- Storage: 1TB 5400RPM SATA Hard Drive
- OS: Windows 8 64-Bit
October 26, 2012 per press release
Pricing and Availability
Sold online at the Sony Store for $1100 USD at time of analysis (5/17/13).
200,000 Annual Production Volume
1 Product Lifetime (Years)
For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 200000 units and a Product Lifetime Volume of 1 year(s).
Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Total BOM: $611.03
Top Cost Drivers below: $491.53
% of Total BOM 80%
Main Cost Drivers below
Intel AV8063801057605 CPU - Intel Core i7-3517U Processor, Dual Cores, 1.9GHz, 4MB Cache, 22nm- (Qty: 1)
LG Display LM200WD4-SLB1 Display Module - 20.0' Diagonal, 16.7M Colors IPS TFT LCD, 1600 x 900 Pixels, LED Backlight- (Qty: 1)
Mastouch Optoelectronics Technologies Display Window / Touchscreen Assembly - 20.0' Diagonal, Capacitive, Glass-Glass Type, Painted, Printed, w/ TSP Controller Board- (Qty: 1)
HGST HTS541010A9E680 Hard Drive - 1TB, 2.5', SATA 6Gb/s, 5400RPM, 8MB Buffer- (Qty: 1)
Nanya NT4GC64C88B0NS-DI SO-DIMM DDR3-1600 - 4GB, 512Mx64, 1.35V- (Qty: 2)
Hannstar 8-Layer - FR4, Lead-Free, Halogen-Free- (Qty: 4)
Panasonic VGP-BPS21A Battery Pack - Li-Ion, 6-Cell, 10.8V, 5000mAh, 54Wh- (Qty: 1)
Intel BD82HM76SLJ8E Platform Controller Hub - HM76 Express Chipset, 65nm- (Qty: 1)
Darfon VGP-WKB14 Wireless Keyboard - 2.4GHz- (Qty: 1)
Delta Electronics VGP-AC19V49 AC Adapter - 19.5V, 3.3A, 65W, w/ 6ft Cord & Velcro Strap- (Qty: 1)
Not Included in Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.
Country of Origin
For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.
Box Contents - China
BT / WLAN Half Mini PCIe Module - China
Display / Touchscreen - China
Misc Interface PCBs - China
Motherboard - China
NFC Module - China
Other - Enclosures / Final Assembly - China
Storage Device - China
Webcam Module PCB - China
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as TBD), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.
Component Qty: 1438 - Motherboard
Component Qty: 173 - Display / Touchscreen
Component Qty: 1 - Storage Device
Component Qty: 27 - Box Contents
Component Qty: 388 - Other - Enclosures / Final Assembly
Component Qty: 50 - BT / WLAN Half Mini PCIe Module
Component Qty: 65 - NFC Module
Component Qty: 84 - Misc Interface PCBs
Component Qty: 43 - Webcam Module PCB
Component Qty: 2269 - Grand Total