Acquired Electronics360

Mobile Devices

Lenovo A765e Mobile Handset Teardown

23 July 2013
The following is an overview of a teardown analysis conducted by IHS Technology Teardown Services.

Summary Points

4.5' IPS Panel based smartphone
Qualcomm MSM8625 Core (S4 SnapDragon 1.2GHz)
Very little marketing and pricing information found on this particular model

Target Market

Entry-Level Smartphone

Primarily oriented at the domestic Chinese market - but has been released to other international markets. Per Lenovo the A800 is an 'All-Round Entry-Level Smartphone'.


January 2013 Assumed

Exact release date not found - but assumed beginning 2013.

Pricing and Availability

$180+ USD Based on a cursory Google search of various China sources

ASPs always vary from country to country based on local currencies.


Domestic China market is assumed to be main target market.

Lenovo A765e Mobile Handset - Main PCB TopLenovo A765e Mobile Handset - Main PCB Top

Volume Estimations

800,000 Annual Production Volume
0.5 Product Lifetime (Years)

For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 800000 units and a Product Lifetime Volume of 0.5 year(s).

Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Lenovo A765e Mobile Handset Cost AnalysisLenovo A765e Mobile Handset Cost Analysis

Cost Notes

Total BOM: $106.39
Top Cost Drivers below: $76.64
% of Total BOM 72%

Main Cost Drivers below

Tianma - Display Module - 4.5' Diagonal, 16.7M Color TFT (IPS Mode), 854 x 480 Pixels, 116.5um x 116.5um Pixel Size, 99.50mm x 55.93mm Viewable Area- (Qty: 1)
Qualcomm - MSM8625A Apps / Baseband Processor - Multi-Mode, GSM/EDGE/WCDMA/CDMA/EVDO Rev B, gpsOne, Dual-Core ARM Cortex A5 1.2GHz, Adreno 203 GPU- (Qty: 1)
O-Film - Display Window / Touchscreen Assembly - 4.5' Diagonal, Capacitive, Glass-Film-Film Type, w/ Tempered Cover Glass, & Synaptics S2202B Touchscreen Controller- (Qty: 1)
SK Hynix - H9DP32A4JJAC MCP - 4GB eMMC NAND + 512MB Mobile DDR- (Qty: 1)
Primary Camera Module - 5MP, BSI CMOS, 1/4' Format, Auto Focus Lens- (Qty: 1)
Qualcomm - RTR6285A RF Transceiver - ZIF, Quad-Band GSM/EDGE, Tri-Band UMTS/HSPA Transceiver w/ Rx Diversity, w/ Integrated GPS Receiver & Rx Diversity, 0.18um RF CMOS- (Qty: 1)
Lenovo - BL204 Battery - Li-Polymer, 3.7V, 1700mAh- (Qty: 1)
Qualcomm - RTR6500 RF Transceiver - CDMA2000 1X / EVDO, w/ Integrated GPS Receiver & Receive Diversity, 0.18um RF CMOS Process- (Qty: 1)
Enclosure, Main, Top - Die-Cast Magnesium, Painted, w/ Injection Molded Polycarbonate Frame, FIP Gasket, & 3 Brass Inserts- (Qty: 1)
China Circuit Technology - 10-Layer - FR4/RCF HDI, 2+6+2, Stacked Via, Lead-Free- (Qty: 1)

Lenovo A765e Mobile Handset - Main PCB BottomLenovo A765e Mobile Handset - Main PCB Bottom

Not Included in Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.

Country of Origin

For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.

Box Contents - China
Camera Assembly - China
Display / Touchscreen - China
Main PCB - China
Misc PCB Assemblies - China
Other - Enclosures / Final Assembly - China

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as combo modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Lenovo A765e Mobile Handset - Disassembly View 1Lenovo A765e Mobile Handset - Disassembly View 1

Design Complexity

Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.

Component Qty: 607 - Main PCB
Component Qty: 14 - Display / Touchscreen
Component Qty: 17 - Box Contents
Component Qty: 44 - Camera Assembly
Component Qty: 64 - Other - Enclosures / Final Assembly
Component Qty: 46 - Misc PCB Assemblies
Component Qty: 792 - Grand Total

The average smartphone has about 1000 components making this device relatively simple to produce.

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter


Date Event Location
12-16 Aug 2018 Vancouver, Canada
11-13 Sep 2018 Novi, Michigan
27 Sep 2018 The Reef, Los Angeles
26 Oct 2018 Old Billingsgate
04-06 Dec 2018 Orlando, FL
Find Free Electronics Datasheets