Mobile Devices

Sony Xperia Z (C6603) Mobile Handset Teardown

25 July 2013
The following is an overview of a teardown analysis conducted by IHS Benchmarking.

Summary Points

  • 1080p HD 5' Display Android high-end flagship smartphone for Sony
  • Water resistance is touted feature - common with Japan-market phones
  • HDR video is another standout feature (part of 13MP primary camera module)
  • Similar core architecture (QCOM APQ8064 apps processor and MDM9215 wireless core) to HTC One
  • AP8064 (used here) is slightly lower GHz speed (1.5GHz) than AP8064AB version in HTC One (1.7GHz)

Target Market

High-End Smartphone

Sony Xperia Z (C6603) Mobile Handset Main ImageSony Xperia Z (C6603) Mobile Handset Main Image


Q1 2013 Announced at 2013 CES

Pricing and Availability

$540+ USD Based on Google shopping search - international pricing will vary


Sony Xperia Z (C6603) Mobile Handset - Main PCB TopSony Xperia Z (C6603) Mobile Handset - Main PCB Top

Volume Estimations

10,000,000 Annual Production Volume
1 Product Lifetime (Years)

For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 10000000 units and a Product Lifetime Volume of 1 year(s).

Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.

Sony Xperia Z (C6603) Mobile Handset Cost AnalysisSony Xperia Z (C6603) Mobile Handset Cost Analysis

Cost Notes

Total BOM: $203.19
Top Cost Drivers below: $149.14
% of Total BOM 73%

Main Cost Drivers below

JAPAN DISPLAY INC - Display Module - 4.97' Diagonal, 16.7M Color TFT, 1920 x 1080 Pixels, 57.3um x 57.3um Pixel Size, 110.0mm x 61.9mm Viewable Area- (Qty: 1)
QUALCOMM - APQ8064 - Applications Processor - Snapdragon S4 Pro, Quad Krait CPU, 1.5GHz, Adreno 320 GPU, w/ Integrated Bluetooth/GPS/WLAN/USB OTG, 28nm- (Qty: 1)
QUALCOMM - MDM9215M - Baseband Processor - Multi-Mode, Multi-Band, GSM/EDGE/HSPA+/LTE, 28nm- (Qty: 1)
Primary Camera Module - 13.1MP, BSI Stacked CMOS(Exmor RS), 1/3.06' Format, Auto Focus Lens- (Qty: 1)
TPK HOLDING - Display Window / Touchscreen Assembly - 4.97' Diagonal, Capacitive, G2 Type, w/ Asahi Glass Dragontrail? Cover Glass, & Synaptics S3203A Touch Controller- (Qty: 1)
ELPIDA MEMORY INC - EDBA164B1PF-1D-F - SDRAM - Mobile DDR2, 2GB, PoP- (Qty: 1)
QUALCOMM - PM8821 - Power Management IC- (Qty: 1)
- PM8018 - - (Qty: 1)
- PM8921 - - (Qty: 1)
UNIMICRON TECHNOLOGY CORPORATION - 12-Layer - FR4/RCF HDI, Any Layer Stacked Via, Lead-Free- (Qty: 1)
QUALCOMM - WTR1605L - RF Transceiver - Multi-Mode, Multi-Band, CDMA/GSM/EDGE/EVDO Rev. B/HSPA+/LTE, GPS/GLONASS, 65nm- (Qty: 1)

Sony Xperia Z (C6603) Mobile Handset - Main PCB BottomSony Xperia Z (C6603) Mobile Handset - Main PCB Bottom

Not Included in Analysis

The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.

We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.

Country of Origin

For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.

Box Contents - China
Camera Assembly - China
Display / Touchscreen - China
Main PCB - China
Misc PCB Assemblies - China
Other - Enclosures / Final Assembly - China

Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as combo modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.

Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.

Sony Xperia Z (C6603) Mobile Handset - Disassembly View 1Sony Xperia Z (C6603) Mobile Handset - Disassembly View 1

Design Complexity

Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.

Component Qty: 979 - Main PCB
Component Qty: 3 - Display / Touchscreen
Component Qty: 113 - Other - Enclosures / Final Assembly
Component Qty: 55 - Camera Assembly
Component Qty: 16 - Box Contents
Component Qty: 52 - Misc PCB Assemblies
Component Qty: 1218 - Grand Total

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