- Huawei 'Ascend' is the flagship series for Huawei brand
- 5 inch Full HD display - Quad Core 1.5GHz - 13MP Camera w/ BSI Sensor
- Phone leverages HiSilicon chips heavily in all key slots
- Our analysis suggests 'in-house' HiSilicon chips give Huawei significant cost advantage
Announced at CES 2013
Pricing and Availability
~$500 USD+ Unlocked in US market - Pricing will vary internationally
1,000,000 Annual Production Volume
1 Product Lifetime (Years)
For the purposes of this teardown analysis, we have assumed an Annual Production Volume of 1000000 units and a Product Lifetime Volume of 1 year(s).
Teardown volume and production assumptions are primarily used for our cost analysis in terms of amortized NRE and tooling costs, especially for custom components specific to the model being analyzed (mechanical components especially). Unless assumed volumes are different by an order of magnitude, minor changes in volume (say 1 million vs. 2) rarely have a large net effect on our final analysis because of this.
Total BOM: $185.34
Top Cost Drivers below: $133.25
% of Total BOM 72%
Main Cost Drivers below
JAPAN DISPLAY INC - DCX801AKM-456T34 - Display Module - 4.97' Diagonal, 16.7M Color TFT, 1920 x 1080 Pixels, 57.3um x 57.3um Pixel Size, 110.0mm x 61.9mm Viewable Area- (Qty: 1)
TOSHIBA SEMICONDUCTOR - TYA0HH131570RC - MCP - 32GB eMMC NAND + 1Gb Mobile DDR- (Qty: 1)
Primary Camera Module - 13MP, CMOS, 1/3' Format, Auto Focus Lens- (Qty: 1)
HISILICON - Hi3620GFC - Application Processor - Quad-Core ARM Cortex-A9 CPU, 1.5GHz, w/ 1MB L2 Cache, 16-Core GPU, 40nm, PoP- (Qty: 1)
Display Window / Touchscreen Assembly - 4.97' Diagonal, Capacitive, Glass Glass Type, w/ Corning Gorilla?Glass Cover Glass, & Synaptics S7020A Touch Controller- (Qty: 1)
HISILICON - Hi6920GFC - Baseband Processor - Multi-Mode, Multi-Band, GSM/EDGE/TD-SCDMA/WCDMA/LTE/TD-LTE- (Qty: 1)
ELPIDA MEMORY INC - EDBA164B1PB-1D-F - SDRAM - Mobile DDR2, 2GB, PoP- (Qty: 1)
Battery - Li-Polymer, 3.8V, 2900mAh, 11.1Wh, w/ Flex PCB & Board to Board Connector- (Qty: 1)
COMPEQ MANUFACTURING CO LTD - 10-Layer - FR4/RCF HDI, Any Layer Stacked Via, Lead-Free- (Qty: 1)
TEXAS INSTRUMENTS INC - WL1873 - Bluetooth / GNSS / WLAN - IEEE802.11a/b/g/n, Bluetooth V4.0, GPS / GLONASS, w/ FM Transceiver- (Qty: 1)
Not Included in Analysis
The total materials and manufacturing costs reported in this analysis reflect ONLY the direct materials cost (from component vendors and assorted EMS providers), AND manufacturing with basic test. Not included in this analysis are costs above and beyond the material manufacture of the core device itself - cost of intellectual property, royalties and licensing fees (those not already included into the per component price), software, software loading and test, shipping, logistics marketing and other channel costs including not only EMS provider and the OEM's margin, but that of other resellers. Our cost analysis is meant to focus on those costs incurred in the manufacture of the core device and exceptionally in some circumstances the packaging and literature as well.
We do provide an Excel tab 'Overall Costs' where a user can enter their known pre and post production costs to build a per unit cost reflective of theirs actual expenditures.
Country of Origin
For the purposes of this analysis, we are assuming the following country(ies) of origin for each level of assembly, based on a combination of 'Made In' markings, and/or assumptions based on our knowledge of such equipment.
Box Contents - China
Camera Assembly - China
Display / Touchscreen - China
Main PCB - China
Misc PCB Assemblies - China
Other - Enclosures / Final Assembly - China
Country of origin assumptions relate directly to the associated cost of manufacturing, where calculated by iSuppli. In the cases of 'finished' sub-assemblies (such as combo modules), we do not calculate internal manufacturing costs, but rather assess the market price of the finished product in which case country of origin assumptions may or may not have a direct effect on pricing.
Labor rates are applied directly only to hand inserted components and systems in our bill of materials, and although regional assumptions do, these new rates do not have a direct effect on our modeled calculations of placement costs for automated SMD assembly lines. "Auto inserted components (such as SMT components) placement costs are calculated by an iSuppli algorithm which allocates a cost per component based on the size and pincount of the device. This calculation is affected by country or region of origin as well.
Component counts by assembly and the number of assembly are indicators of design complexity and efficiency.
Component Qty: 1216 - Main PCB
Component Qty: 2 - Display / Touchscreen
Component Qty: 116 - Other - Enclosures / Final Assembly
Component Qty: 54 - Camera Assembly
Component Qty: 17 - Box Contents
Component Qty: 85 - Misc PCB Assemblies
Component Qty: 1490 - Grand Total