Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Click here to request full access. To view a complimentary report of Honor Magic V2 VER-AN10, click here.
Foldable phones are becoming a hot item on the market as users look to branch out from traditional smartphones and to phones that add a little more bang for their buck.
Foldable phones are unique in that they have the capability to fold out to double its size and become more a tablet size device rather than smartphone size.
The Vivo X Fold3 Pro is the latest incarnation from the Chinese telecom that folds from a normal size smartphone into a tablet style phone with numerous cameras. It joins a host of other phones that are on the market that include this foldable feature.
The following is a partial deep dive into the Vivo X Fold3 Pro conducted by TechInsights.
Summary
- 16 GB mobile LPDDR5X SDRAM
- Main camera 32 MP BSI CMOS
- Secondary camera 32 MP BSI CMOS
Released: April 2024
Price: $1,381
Target market: Communications
Availability: China
Main board
The main board of the Vivo X Fold3 Pro includes the Snapdragon 8 generation 3 processor as well as the main memory from Samsung. Other electronic components include:
- Power management ICs from Qualcomm
- Class-D audio amplifier from Goodix
- Image signal processor from Vivo
- Hall effect sensor from MEMSIC
- 3 A step-down DC-DC converter from Halo Micro
- SIM card interface level translator from Nexperia
- Ambient light sensor from AMS
- NFC and secure element chip from NXP Semiconductors
- RF switch from Maxscend
(Learn more about sensor chips on Globalspec)
The antenna board is a communications board found inside the Vivo X Fold 3 Pro. Source: TechInsights
Antenna board
The antenna board is the host of the RF and communications ICs that connects to the main board and enables cellular connections. The electronic components on the board include Maxscend’s RF antenna tuner and other connectors.
(Learn more about chip antenna on Globalspec)
The auxiliary board found inside the Vivo X Fold 3 Pro. Source: TechInsights
Auxiliary board
The auxiliary board is the secondary board on the foldable phone as part of the secondary touchscreen. The main components on this board include:
- Sensortek’s ambient light sensor
- Silicon Mitus’ display power management IC
- AWINIC’s 16-channel GPIO controller
- ST Microelectronics’ six-axis MEMS accelerometer and gyroscope and MEMS nano pressure sensor
- Nisshinbo Micro Devices’ 600 mA step-down DC-DC converter
- SGMicro’s AMOLED display power supply
- Qorvo’s RF antenna tuner
- Murata’s SAW filter
- AKM Semiconductor’s hall effect sensor
- Maxscend’s RF switch ICs
(Learn more about MEMS devices on Globalspec)
Some of the components found inside the Vivo X Fold 3 Pro. Source: TechInsights
Major components
- $134.39 Octa-core Snapdragon 8 Gen 3 applications/baseband processor — Qualcomm (Qty: 1)
- $133.75 — 120 Hz main display/touchscreen subsystem — Samsung (Qty: 1)
- $53.81 — 50 MP wide-angle rear camera subsystem (Qty: 1)
- $41.18 — 16 GB mobile LPDDR5X SDRAM — Samsung (Qty: 1)
- $35.02 — 512 GB 3D TLC-V-NAND Flash — Samsung (Qty: 1)
- $32.75 — 64 MP Telephoto rear camera subsystem — Semco (Qty: 1)
- $32.21 — 120 HZ secondary display/touchscreen subsystem — BOE (Qty: 1)
- $20.68 — Main frame right (Qty: 1)
- $20.14 — Main frame left (Qty: 1)
- $18.24 — 50 MP ultra-wide-angle rear camera subsystem (Qty: 1)
