Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Click here to request full access. To view a complimentary report of Huawei Pura 70 Pro+, click here.
While Huawei has been hit by sanctions from several countries, it continues to develop smartphones for domestic use and emerging markets.
The company is also developing its own processors so it does not have to rely on outside sources for its main applications processor. But while that has not been confirmed, Huawei continues to use HiSilicon’s processors for current smartphones.
While the export restrictions on Huawei may hinder its attempt to regain a top position in the smartphone market soon. Developments may allow it to compete at a higher level if it can get Chinese foundries to develop process technology that can compete with Qualcomm, MediaTek and more.
Meanwhile, the Huawei Pura 70 Pro+ smartphone is one of the latest devices from the Chinese vendor that includes numerous components from domestic vendors like Yangtze Memory and HiSilicon.
The following is a partial deep dive into the Huawei Pura 70 Pro+ conducted by TechInsights.
Summary
- 6.77 inch AMOLED
- 16 GB Mobile LPDDR5 SDRAM
- 13 MP CMOS BSI
- 50 MP CMOS BSI
- 48 MP CMOS Periscope Telephoto
Released: April 2024
Price: $1,250
Availability: China
Target market: Consumer
Main board
The main board of the Huawei Pura 70 Pro+ smartphone houses the main applications processor from HiSilicon as well as the main memory from Yangtze Memory. Other electronic components include:
- Maxcend’s 2.4 GHz Wi-Fi front-end module and RF switch
- Huaying’s SAW filters
- QST’s three-axis electronic compass
- AWINIC’s LDO regulator and three-channel capacitive touch and proximity controller
- OnMicro’s RF power amp
- SouthChip’s single-cell battery charger
- OmniVision’s SIM card interface level translator
- 3Peak’s SPDT analog switch
- HiSilicon’s Wi-Fi 6/Bluetooth IC, power management ICs and average power tracker
- Kinetic Technologies’ load switch
- Tsingteng Microsystem’s NFC controller
- Bosch Sensortec’s six-axis MEMS accelerometer and gyroscope
- ETEK’s camera power management IC
(Learn more about power management ICs on Globalspec.com)
RF board
The RF board contains the following electronic components:
- Maxscend’s RxD front-end module and RF switch
- Huaying’s SAW filter
- HiSilicon’s HB/MB front-end module
- OnMicro’s multimode, multiband power amplifier
(Learn more about RF and wireless chips on Globalspec.com)
Periscope telephoto rear camera subsystem
The 48-megapixel periscope telephoto rear camera subsystem has components that are used to operate this camera. The components include:
- Dongwoon Anatech’s AF controller and driver
- SGMicro’s LDO regulator
- AWINIC’s VCM driver
- Giantec Semiconductor’s serial EEPROM memory
- Sony’s 50 MP BSI CMOS image sensor
(Learn more about image sensors on Globalspec.com)
Some of the components found inside the Huawei Pura 70 Pro+ smartphone. Source: TechInsights
Major components
- $78.26 — 1 TB 3D TLC NAND Flash memory – Yangtze Memory (Qty: 1)
- $74.34 — Kirin 9010 octa-core application/baseband processor — HiSilicon (Qty: 1)
- $64.85 — 50 MP wide-angle rear camera subsystem (Qty: 1)
- $38.34 — 16 GB mobile LPDDR5 SDRAM (Qty: 1)
- $34.54 — 48 MP periscope telephoto rear camera subsystem (Qty: 1)
- $31.57 — 120 Hz Display/touchscreen subsystem — Visionox (Qty: 1)
- $17.59 — 12.5 MP ultra-wide-angle rear camera subsystem (Qty: 1)
- $16.90 — 13 MP wide-angle front camera subsystem (Qty: 1)
- $13.25 — Main enclosure
- $9.59 — Wi-Fi 6/Bluetooth 5.2 GPS — HiSilicon (Qty: 1)