As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at Surface Mount Technology Association International (SMTAI), to be held October 19 to October 23 in Rosemont, Illinois.
October 20 
4:30 PM
A Bi-Free In-Containing Lower Temperature Solder with Superior Drop Shock Resistance and Electromigration Resistance, presented by associate scientist Mengyao Wen, authored by Dr. Hongwen Zhang, Danyang Zeng and Huaguang Wang
October 21
9:00 AM
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly With Lower Temperature Soldering Phase I: Processing Optimization, presented by associate scientist Cassandra Goppert, authored by Dr. Hongwen Zhang, Dr. Francis Mutuku and Huaguang Wang
11:00 AM
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly With Lower Temperature Soldering Phase II: TCT Reliability, presented by R&D manager, Alloy Group, principal metallurgist Dr. Hongwen Zhang, co-authored by Danyang Zeng, Huaguang Wang and Dr. Francis Mutuku
2:00 PM
Effect of Copper Content on Interfacial Reaction of In-Containing Lead-Free Solder Joints Across Different Surface Finishes, presented by research metallurgist Huaguang Wang
4:30 PM
Supercooled Solder Pastes for Low-Temperature Electronics Manufacturing, presented by Associate Scientist I Radhika Jadhav, co-authored by Dr. Yifan Wu and Dr. Ian Tevis
October 22
2:00 PM
A Novel Flux-Less Solder Paste Reflowed Under Formic Acid for Surface Mounting Technology, presented by R&D assistant manager Lily Bai
2:30 PM
Application of New Ultra-Low Residue Solder Paste for System-in-Package, presented by senior area technical manager, East China, Leo Hu Yan Jie, co-authored by Jonas Sigfrid Sjoberg, Xinfang Liu, Jinjin Bai and Fiona Chen
3:00 PM
Influence of Reflow Temperature on the Mechanical Strength of Lower-Temperature Solder Pastes Across Various Surface Finishes, presented by research chemist-metallurgist Dangyang Zheng, co-authored by Liam Evans, Cassandra Goppert, Mengyao Wen, Dr. Huaguang Wang, Dr. Francis Mutuku and Dr. Hongwen Zhang
5:30 PM
Void Mitigation for Exposed Pad of D2PAK Component, presented by associate director for global technical services and application engineering Jonas Sjoberg, authored by Tushar Tike
6:00 PM
Optimizing Mixed Alloy Solder Pastes for Low Voiding and High PCB Reliability, presented by technical support engineer II Thuy Nguyen, co-authored by Dr. Hongwen Zhang, Dr. Ronald C. Lasky and Adam Murling
October 23
9:00 AM
Tin Whiskers 101: 2025, presented by senior technologist Dr. Ron Lasky
The full agenda is available on the SMTAI website. To learn more about Indium Corporation’s high-reliability solutions, visit the company’s experts at SMTAI in booth 2842.
