Industrial Electronics

MacDermid Alpha to exhibit and present five technology papers at SMTA International

21 September 2020

MacDermid Alpha Electronics Solutions, a provider of specialty chemistries, electronic soldering and bonding materials, will exhibit its latest interconnect technologies and present five technical papers during the Surface Mount Technology Association (SMTA) International Virtual Conference and Exhibition from September 28 to 30, 2020.

Three of the MacDermid Alpha brands, MacDermid Enthone, Alpha and Kester will showcase their latest solutions for electronics manufacturers. MacDermid Enthone will feature Systek SAP, UVF 100 and ETS 1200, its most recent and innovative processes in its IC substrate metallization offerings. Alpha will promote ALPHA OM-220, an ultra-low temperature solder that enables peak reflow temperatures below 150° C, making it ideal for soldering heat sensitive components. Kester will feature its newest solder paste NP505-HR, a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high reliability applications.

Two of the papers presented will focus on substrates and PCB technology. Research and development chemist Sean Flueriel will present “Pit Resistant Acid Copper Electroplating Process for Flash Etching.” Applications specialist Carmichael Gugliotti will present “Single Step Metallization Process for the Filling of Through Holes with Copper.”

Two of the papers will have an assembly focus. As part of the Flux, Solder, Adhesives track, Dr. Karen Tellefsen will present “Advanced SIR Testing for Trapped Solder Paste Flux Residue.” Dr. Morgana Ribas will present “High-Reliability, Fourth Generation Low-Temperature Solder Alloys” in the Lead-Free and Low-Temp Soldering Technologies track. In addition, Lenora Clark, director of OEM applications for Elements Solutions Automotive, will present “A Cruise Through Automotive Safety Systems.”

For information on the time and dates of the papers, please visit SMTA International.

To contact the author of this article, email engineering360editors@globalspec.com


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