German chipmaker Infineon Technologies AG has expanded its XENSIV microelectromechanical systems (MEMS) microphone lineup with two digital PDM microphones.
Using Infineon’s sealed dual membrane (SDM) technology, the MEMS microphones, called the IM72D128B and IM69D129F, offer water and dust resistance, improved audio performance and energy efficiency.
The IM72D128V has a signal-to-noise ratio (SNR) of 71.5 dB and a 430 µA in high-performance mode and 160 µA in low-power mode, which makes it suitable for low-noise audio pickup applications such as high-end headphones.
The IM69D129F MEMS microphone features an audio performance with an SNR of 69 dB and features a low power consumption, operating at 450 µA in high performance mode and 170 µA in low-power mode. This allows the microphone to be used to extend battery life in portable devices like:
- Headphones and earbuds
- Laptops
- Tablets
- Conference systems
- Cameras
Both MEMS devices support voice user interface (VUI) applications in smart speakers, automotive infotainment, internet of things devices, industrial monitoring, security systems and home and industrial automation.
