Mobile Devices

TechInsights Teardown: Apple iPhone 15

16 February 2024

The iPhone 15 is the latest smartphone in the popular line of devices from Apple featuring more processing power than ever before. Source: TechInsights The iPhone 15 is the latest smartphone in the popular line of devices from Apple featuring more processing power than ever before. Source: TechInsights

Editor’s note: Information from this teardown is supplied courtesy of TechInsights. Learn more about the Apple iPhone 15 smartphone teardown here.

The popularity of the Apple iPhone is only growing. In fact, recently it was revealed the iOS device reached record levels in 2023 and attained the top spot in the Chinese smartphone market for the first time.

The device is also becoming more powerful with the hexa-core 64-bit Apple applications processor embedded as the main engine inside the portable device. It also boasts 6 GB mobile SDRAM from SK Hynix in the standard edition and even more in the Pro series.

The following is a partial deep dive into the latest smartphone from Apple conducted by TechInsights.

Summary

  • 6.14 inch AMOLED
  • 6 GB mobile LPDDR5 SDRAM
  • 12 MP camera
  • 1.4 MP IR camera
  • 48 MP wide-angle camera

Released: September 2023

Availability: Worldwide

Price: $890

The main board of the iPhone 15 contains the main processor in the A16 from Apple and main memory. Source: TechInsightsThe main board of the iPhone 15 contains the main processor in the A16 from Apple and main memory. Source: TechInsights

Main board

The main board houses the primary applications processor for the Apple iPhone 15, the 64-bit hexa-core A16, and the main memory, the SK Hynix 6 GB mobile LPDDR5X SDRAM. Other electronic components include:

  • Skyworks’ RxD front-end module, quad-band GSM power amplifier
  • Broadcom’s HB and MB front-end module
  • Samsung’s display power management
  • Murata’s 2.4 GHz Wi-Fi front-end module
  • Bosch Sensortec’s six-axis MEMS accelerometer and gyroscope
  • Apple’s audio amplifier
  • USI’s UWB module
  • Onsemi’s 600 mA synchronous boost regulator
  • ST Microelectronics’ camera power management
  • NXP Semiconductors’ NFC controller
  • Texas Instruments’ Flash LED driver

(Learn more about MEMS devices on Globalspec.com)

The USB flex is the connector to outside devices fro the Apple iPhone 15. Source: TechInsightsThe USB flex is the connector to outside devices fro the Apple iPhone 15. Source: TechInsights

USB connector flex

The USB board contains several electronic components needed in operation of external connections to the smartphone. The board contains mainly RF tuner ICs from Qorvo.

(Learn more about RF chips on Globalspec.com)

The RF board is the main connector hub for the 5G, Wi-Fi and Bluetooth systems inside the Apple iPhone 15. Source: TechInsightsThe RF board is the main connector hub for the 5G, Wi-Fi and Bluetooth systems inside the Apple iPhone 15. Source: TechInsights

RF board

The RF board inside the Apple iPhone 15 contains the communication systems for Bluetooth, Wi-Fi and 5G operations for the smartphone. The main electronic components include:

  • Broadcom’s FBAR filter, RF switch, RF LNA and diplexer
  • ST Microelectronics’ serial EEPROM memory
  • Qorvo’s GPIO interface and 5G average power tracker
  • Qualcomm’s Snapdragon X70 5G modem with memory, clock buffer and RF transceiver
  • USI’s Wi-Fi 6E/Bluetooth IC
  • Skyworks’ RxD front-end module and RF switch
  • Murata’s RxD front-end module and RF switch
  • Analog Devices’ engine driver
  • Apple’s audio amplifier

(Learn more about power management ICs on Globalspec.com)

Some of the components found inside the Apple iPhone 15. Source: TechInsights Some of the components found inside the Apple iPhone 15. Source: TechInsights

Major components

  • $71.33 — 64-bit hexa-core applications processor — Apple (Qty: 1)
  • $46.40 — 48 MP wide-angle rear camera subsystem (Qty: 1)
  • $46.00 — Super retina display/touchscreen subsystem — Samsung (Qty: 1)
  • $25.42 — Snapdragon X70 5G modem with memory — Qualcomm (Qty: 1)
  • $21.67 — Main enclosure (Qty: 1)
  • $16.30 — 12 MP ultra-wide-angle rear camera subsystem (Qty: 1)
  • $13.14 — Back cover
  • $12.88 — 12 MP front camera subsystem — Foxconn (Qty: 1)
  • $11.22 — RF transceiver + GPS — Qualcomm (Qty: 2)
  • $11.02 — IR camera/dot projector subsystem (Qty: 1)
To contact the author of this article, email GlobalSpecEditors@globalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement