Deca Technologies has signed an agreement with IBM Canada to implement its fan-out interposer and adaptive patterning technologies into IBM’s high-volume advanced packaging facility in Bromont, Quebec, Canada.
The Bromont plant is one of the largest chip assembly and test sites as well as one of the most advanced packaging facilities in North America. The site was expanded recently to be a hub for high-performance packaging and chiplet integration.
When combined with Deca’s M-series fan-out interposer, this facility will be applicable for:
- AI
- High-performance computing
- Data centers
The M-Series fan-out interposer technology is an alternative to full silicon interposers designed to improve signal integrity, greater design flexibility and scalable format for these applications.
