MEMS and Sensors

CES 2025: Tiny integrated speaker-microphone launched

23 December 2024

Israeli startup SonicEdge will debut at CES 2025 what it claims to be the world’s smallest integrated speaker-microphone in a single package for true wireless stereo (TWS) earbuds and headphones.

The device, called SonicTwin, measures 8 mm x 4 mm x 1 mm and combines sound generation and sensing capabilities in a single device. The audio chip is based on the company’s modulated ultrasound technology that eliminates traditional mechanical vibrations for integration of speakers and sensors.

“SonicTwin reduces latency and enables better ANC,” said Ari Mizrachi, CTO and co-founder of SonicEdge.

The modulated ultrasound technology replaced traditional voice coils that enable:

  • Higher efficiency
  • Enhanced sound quality
  • Co-packaged sensors

SonicEdge said reducing the number of components helps to minimize complexity and accelerate time-to-market.

To contact the author of this article, email PBrown@globalspec.com


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