The ED2 Universal Glass Package (UGP100) is an innovative surface-mount hermetic solution that delivers exceptional performance at a fraction of the cost of traditional hermetic sealing methods. Engineered for operation beyond 100 GHz, this compact surface-mount technology (SMT) package measures just 3.5 mm x 4.3 mm and features a copper-based construction for superior heat dissipation and thermal management.
Optimized for high-frequency applications, the UGP100 is an excellent choice for packaging high-frequency amplifiers, attenuators, limiters or multifunction radio frequency (RF) devices operating up to 100+ GHz. ItsSource: ED2 design ensures minimal performance variation and outstanding repeatability from part to part. Additionally, the UGP100 is RoHS-compliant, meets industry standards, and provides a hermetic sealing solution ideal for demanding environments.
Features
- -40° C to 85° C
- Moisture sensitivity level: MSL2A
- Surface mount package
- Room for eight single layer caps (SLCs)
Applications
- Aerospace equipment including aircraft and satellites
- Military/defense systems including communication equipment, radar systems, and other electronics and devices
- Telecommunications, particularly those for harsh environments
- Instrumentation and controls
- Medical equipment and devices