Industrial Electronics

ED2 is enabling +100 GHz functionality

19 December 2024

The ED2 Universal Glass Package (UGP100) is an innovative surface-mount hermetic solution that delivers exceptional performance at a fraction of the cost of traditional hermetic sealing methods. Engineered for operation beyond 100 GHz, this compact surface-mount technology (SMT) package measures just 3.5 mm x 4.3 mm and features a copper-based construction for superior heat dissipation and thermal management.

Optimized for high-frequency applications, the UGP100 is an excellent choice for packaging high-frequency amplifiers, attenuators, limiters or multifunction radio frequency (RF) devices operating up to 100+ GHz. ItsSource: ED2Source: ED2 design ensures minimal performance variation and outstanding repeatability from part to part. Additionally, the UGP100 is RoHS-compliant, meets industry standards, and provides a hermetic sealing solution ideal for demanding environments.

Features

  • -40° C to 85° C
  • Moisture sensitivity level: MSL2A
  • Surface mount package
  • Room for eight single layer caps (SLCs)

Applications

  • Aerospace equipment including aircraft and satellites
  • Military/defense systems including communication equipment, radar systems, and other electronics and devices
  • Telecommunications, particularly those for harsh environments
  • Instrumentation and controls
  • Medical equipment and devices
To contact the author of this article, email GlobalSpecEditors@globalspec.com


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