Smiths Interconnect was the recipient of the Best Test Measurement Award of the Year at the annual Global Electronics Achievement Awards (GEAA) event, held earlier this month in Shenzhen, China.
Specifically, Smiths Interconnect was recognized for its DaVinci 112, a high-speed test socket designed for testing the complex functionality of application-specific integrated circuits (ASICs). Smiths said testing ASICs at full functionality is challenging: The hundreds of PAM-4 signals involved makes it critical to isolate pin-to-pin cross talk below -40 dB frequency. The DaVinci 112 socket supports large-size chips up to 130 mm x 130mm with more than 30,000 input/outputs and a coplanarity tolerance of up to 0.65 mm, effectively preventing connection issues due to poor coplanarity and ensuring superior signal integrity. By eliminating false faults and complete functional failures, the DaVinci 112 increases production yields and throughput.
The R&D team behind the DaVinci 112 developed an innovative mechanical structure to prevent socket warping — a common challenge in high pin-count and high-power testing applications. This design enhancement guarantees reliable ground contact, delivering improved power transmission and signal isolation. Additionally, the DaVinci 112’s use of advanced IM conductive materials offers robust mechanical stability, making it a fit for high-speed, high-power chip testing in sectors such as high-performance computing, data centers and mobile devices.
Features of the DaVinci 112 include:
- Solution for BGA, LGA and other variants
- Spring probe technology using homogenous alloy gold plated
- RF Bandwidth greater than 40 Ghz at -1 dB IL
- Short signal path 4.90 mm test height
- 43, 50 Ohm impedance (single-ended)
- Consistent stable contact resistance 80 mΩ (Ave)
- Hi-coplanarity accommodation
- Tri-temp socket design to support -55 °C to 125 °C
- Designed for manual test, bench test and high-volume manufacturing production test using the same socket
Benefits include:
- Long contact life, tested to 500K insertions
- Impedance that can match the system or be defined as needed
- Excellent DC performance
- Patented insulated metal socket housing for optimal signal integrity performance and strength
- Precision-machined socket housing for robust mechanical performance
- Field repairable: replace a single probe or full array
- Cleaning can be done online with a cleaning surrogate
- Match existing PCB socket footprint and test hardware translates to cost savings