Smiths Interconnect has announced the launch of DaVinci Gen V, the latest flagship product in its DaVinci series portfolio. The product rigorously tests semiconductor chips during the manufacturing process to ensure they provide ultra-reliable and repeatable performance. This is important because these chips are used in a range of areas essential to everyday life, including artificial intelligence (AI) accelerators, automotive systems and next generation 6G communications networks, that are set for global roll out over the next few years.
Source: Smiths Interconnect
The DaVinci Gen V solves the fundamental industry challenges of impedance tuning — an essential part of circuit design that enables maximum transfer of signal power — and signal integrity — the measurement of quality of an electrical signal as it travels through a circuit. By tackling these challenges, the DaVinci Gen V ensures reliable, super high performance in electronic systems and testing.
The technical specification
The product delivers breakthrough high-speed signal transmission performance. It enables unprecedented digital signaling speeds of up to 224 Gbps PAM4 for AI accelerators and beyond 100 GHz for 6G frequencies — these speeds are crucial for supporting the growing demand for massive data transfer. The product also supports the growing complexity of modern integrated circuits, accommodating a 40% increase in next generation ASIC (application specific integrated circuits) sizes. ASICs are powerful computer chips that combine several different circuits all on one chip, in a ‘system on a chip’ design.
As next-generation integrated circuits continue to evolve — doubling in bandwidth and computational power every two years — DaVinci Gen V is designed for seamless integration. It maintains full compatibility with existing test hardware, allowing manufacturers to transition effortlessly, reduce development cycles and accelerate time-to-market.
