At next week’s Applied Power Electronics Conference (APEC), Texas Instruments will introduce two power conversion device portfolios — a 100 V integrated gallium nitride (GaN) and a 1.5 W isolated DC/DC module.
The 100 V integrated GaN power stages feature thermally enhanced dual-side cooled package technology designed to simplify thermal designs and achieve a high-power density in mid-voltage applications. TI said the 1.5 W isolated DC/DC modules with integrated transformers are the smallest and densest devices designed for shrinking the isolated bias power-supply in automotive and industrial systems by more than 95%.
The GaN devices allow engineers to reduce power-supply solution size and mid-voltage applications by more than 40% and achieve power density of more than 1.5 kW/in3. Additionally, these devices reduce switching power losses by 50% and achieve 98% system efficiency given the lower output capacitance and lower gate-drive losses, TI said.
Meanwhile, the DC/DC modules provide more than eight times power density than discrete solutions and three times higher power density than competing modules, TI said.
With its integrated transformer technology, the modules eliminate the need for an external transformer in a bias supply design. The devices also allow engineers to shrink the solution size by more than 89% and reduce height by up to 75%.
APEC 2024 takes place Feb. 25-29, 2024, in Long Beach, California.
