In the field of materials testing, numerous methods have been established including infrared thermography. Often, it is the combination of different methods that enables the desired results for component characterization. For example, researchers can analyze displacements and mechanical deformations of material samples and components parallel with its thermal reaction.
The ARAMIS system by ZEISS/GOM, using digital image correlation (DIC), offers the appropriate measurement instrument for such investigations. Corresponding DIC evaluations can be combined with thermographic measurements using infrared cameras from InfraTec. The combination of measuring results from the DIC and temperature measuring data from infrared cameras offers the simultaneous analysis of the thermal and mechanical behavior of test specimens in the materials and components testing field. Materials such as metal, plastics and composites as well as electronic power components can be deeply analyzed in this way.
Source: InfraTec
With the special software feature in ARAMIS, users can analyze the correlation between mechanical deformations and thermal behavior in detail and reduce development time thanks to the comprehensive understanding obtained about materials or components under investigation. Learn more about how this works and which benefits it offers users by joining this online event.
Thermography and digital image correlation — A winning team in the materials and components testing field, is scheduled for Wednesday, September 6, 2023, at 10:00 AM to 12:00 PM (CEST).
A lecture on "Heat & Measure — ARAMIS 3D-Deformation and Thermography for Testing Applications" will be delivered by Burak Acun, ZEISS Industrial Quality Solutions/Carl Zeiss GOM Metrology GmbH.
