Arctic Semiconductor, formerly known as SiTune Corp., has announced at Mobile World Congress 2023 (MWC 2023) in Barcelona, Spain, that it is working with Compal Electronics on a new 5G small cell infrastructure platform using its RF transceiver IceWings.
It is the first open ecosystem to leverage the IceWings RF chipset, which was just introduced last month and will integrate with NXP Semiconductor’s Layerscape Access LA12xxx programmable baseband processor. This will allow users to develop platforms with a lower power consumption that beats 3GPP standard requirements.
The Compal and Arctic platform can operate at any 5G FR1 frequency bands from 600 MHz to 7.2 GHz and is capable of supporting speeds beyond Gbps. The 5G small cells and O-RAN radio units produced from the platform will be used in a wide range of applications for distributed networks in public or private bands.
“The introduction of this universal small cell platform is a pivotal point in 5G infrastructure development, allowing 5G coverage to scale anywhere and everywhere at an exponentially faster pace,” said Vahid Toosi, CEO of Arctic Semiconductor.
The IceWings RF 5G transceiver contains four integrated transmitters and receivers, supports a range of standards in signal frequencies below 7.2 GHz and enables millimeter wave (mmWave) applications. The chipset allows for platforms to be created with better yield, low power consumption and a lower cost, Arctic said.