TDK Corp. has expanded its line of microelectromechanical systems (MEMS) microphones designed to bring better acoustic performance and advanced features in a small package footprint.
The IvenSense T5838 and T5837 MEMS microphones offer a solder-free, plug-and-play interface to evaluate and develop multiple types of configurations of microphones, TDK said.
Features of the MEMS microphones include:
- Low power pulse density modulation (PDM)
- High acoustic overload point (AOP) of 133dB SPL
- High signal-to-noise ratio (SNR) of 68 dBA
- Wide dynamic range
TDK said this could be used for environments that shift from very quiet to very loud such as far field voice pickup for smart speakers.
Specifically, the T5837 MEMS devices could be used in smartphones, earbuds, tablets, cameras, Bluetooth headsets and more due to its 310 µA of supply current at 1.8 V.
CES 2023 takes place this week in Las Vegas.
