Russia plans to develop domestic semiconductors initially targeting 90 nm processes later this year with a long-term goal to eventually produce 28 nm processes by 2030.
According to a report from Cnews, the plan is being put in place because of the sanctions placed on the country due to the war in Ukraine and tech companies no longer shipping parts to the region.
The country plans to spend up to $38.4 billion to develop its semiconductor business.
Numerous tech companies have pulled out of shipping parts to Russia after the invasion of Ukraine including semiconductor vendors, automakers, search engines, computer firms and networking equipment operators. Many of these companies have decided to also cut ties completely with the country and will no longer do business there.
Taiwan Semiconductor Manufacturing Co. (TSMC) and Samsung, which acted as foundries for Russian chips, will also no longer supply the region following the sanctions from the U.S. and other countries.
Russia’s relationship with China continues but only 4% of the total IC market was manufactured by Chinese owned companies and Chinese manufacturing lags other sources for process technology.
