Taiwan Semiconductor Manufacturing Corp. (TSMC) has introduced its N4X manufacturing process, a technology designed for high performance computing (HPC) products.
Using TSMC’s 5 nm volume production, the process offers a performance boost of up to 15% over the N5 process, or up to 4% over the even faster N4P at 1.2 V. N4X can achieve drive voltages beyond 1.2 V and deliver additional performance.
Other features of the process technology include:
- Device design and structures optimized for high drive current and maximum frequency.
- Back-end metal stack optimization for high-performance designs.
- High density metal-insulator-metal capacitors for power delivery under extreme performance loads.
“HPC is now TSMC’s fastest-growing business segment and we are proud to introduce N4X, the first in the ‘X’ lineage of our extreme performance semiconductor technologies” said Kevin Zhang, senior vice president of business development at TSMC. “The demands of the HPC segment are unrelenting, and TSMC has not only tailored our ‘X’ semiconductor technologies to unleash ultimate performance but has also combined it with our 3DFabric advanced packaging technologies to offer the best HPC platform.”
The N4X technology includes flexibility with TSMC’s 3DFabric advanced packaging technologies and design enablement platform through its ecosystem partners in the TSMC Open Innovation Platform.
