using highly engineered silver particles, has been specially developed for low-pressure sinter die and package attachment. The paste creates a strong attachment through silver metallic bonds, offering physical strength, unsurpassed electrical conductivity and optimal thermal properties resulting in long-term reliability improvement.“The collaboration between ST and MacDermid Alpha to develop and refine advanced sintering technology has been extremely effective in producing the perfect combination — STPAK package sintered with ALPHA Argomax,“ said Edoardo Merli, power transistor macro-division general manager and group vice president of ST Microelectronics Automotive and Discrete group.
Original equipment manufacturers producing EVs confirmed that the latest drivetrain with sinter technology resulted in 10% improvement in driving range with an overall inverter efficiency of 93%.
“This unique attach process provides an unparalleled level of flexibility, reducing the overall number of power discretes needed and enabling significant cost savings, “ said Julien Joguet, director of marketing — power electronics at MacDermid Alpha. “ALPHA Argomax sinter package and die attach technology, which has already been deployed in more than 2 million electric vehicles, enables manufacturers to produce efficient and reliable electric vehicle powertrains, a key factor in the wider adoption of electric vehicles “
