Industrial Electronics

MacDermid Alpha to participate in the International Electronics Circuit Exhibition

11 November 2020

Electronics chemicals process supplier MacDermid Alpha Electronics Solutions will be exhibiting at the International Electronics Circuit Exhibition hosted by the Hong Kong Printed Circuit Association. The show will be held from December 2 to 4, 2020, at the Shenzhen Convention and Exhibition Center, China.

MacDermid Alpha will be featuring its complete portfolio of metallization technologies from the MacDermid Alpha brand for high-density interconnect designs that provide a continuous metallurgical structure for the most demanding requirements in micro via reliability. MacDermid Alpha will also showcase its product offerings that enable 5G from start to finish from all three divisions and four brands. Also highlighted will be the recently released processes in the IC substrate market: Systek SAP — high performance build-up processes, Systek UVF 100 — via fill and fine line plating for 2-in-1 redistribution layer applications, and Systek ETS 1200 — pattern plating metallization for embedded trace substrates.

Interested participants can stop by booth 2M13 and speak to industry experts about the latest offerings from MacDermid Alpha.

To contact the author of this article, email engineering360editors@globalspec.com


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