Electronics and Semiconductors

Teardown: Velar infotainment master controller

26 June 2020
The following is an overview of a teardown analysis conducted by IHS Benchmarking.
The infotainment controller manages the internal telematics, navigation and entertainment functions of the vehicle. Source: IHS Markit

The number of electronics in vehicles continues to climb with more features being added to cars such as infotainment, flat panel displays, Blu-ray players, wireless connectivity and much more.

The Velar infotainment master controller is designed for Jaguar Land Rover vehicles and includes several electronic components to enable current and future infotainment options in vehicles. The device includes several components from Intel, Microchip, TE Connectivity, Maxim, Broadcom, Rohm and more.

The following teardown includes a partial look at what is inside the Velar infotainment master controller from IHS Markit.

Summary points

  • Estimated to be built by Bosch
  • Intel's embedded compute MXM module with E3845 CPU and 4GB DDR
  • 60 GB industrial grade SSD
  • Mitsumi SDARS can module
  • Intel BT / WLAN 2x2 mini PCI Express module

Target market: Automotive

Released: 2017

Pricing: n/a

Availability: Jaguar Land Rover vehicles

The main PCB inside the Velar infotainment controller. Source: IHS MarkitThe main PCB inside the Velar infotainment controller. Source: IHS Markit

Main PCB

1. Intel Corp., 5M570ZT100A5N, CPLD, Max V, 570, logic elements, 74 I/Os, 0.18 um, automotive

2. Intel Corp., 5M1270ZF256A5N, CPLD, Max V, 1270, logic elements, 211 I/Os, 0.18 um automotive

3. Microchip Technology Inc., LAN89530AM, USB to Ethernet controller, USB 2.0, 10/100Base-TX/FX, automotive

4. Maxim Integrated Products Inc., MAX16942EGee/V+, USB 2.0 protector, data/power switch, 650 mA, automotive

5. TE Connectivity Ltd, 7-338069-6, micro-match, female, vertical

6. Yamaichi Electronics Co. Ltd, BECHS-0.5-230-S9, MXM card edge, right angle, gold plated contacts, automotive

7. Yamaichi Electronics Co Ltd, BECOW-1.5-10-S9, power card edge, right angle, gold plated contacts, automotive

8. Automotive HSD, dual, male, right angle, gold plated contacts

9. Japan Aviation Electronics Industry Ltd, MX62010HQ1R100, pin header, vehicle I/O, shrouded, right angle w/ metal shielding, automotive

10. Automotive HSD, dual, make right angle, gold plated contacts

11. Automotive HSD, make, right angle, gold plated contacts with two-pin header

12. Japan Aviation Electronics Industry Ltd., MX49004NQ1, pin header, vehicle I/O, shrouded, right angle with metal shielding, automotive

13. Pin header, vehicle I/O, 20 contact pins + 4 contact blades, dual row, right angle, shrouded

The embedded compute module inside the Velar infotainment controller. Source: IHS MarkitThe embedded compute module inside the Velar infotainment controller. Source: IHS Markit

Embedded compute module

1. Intel Corp., FH8065301487719, CPU, Intel Atom processor E3845, quad core, 1.91 GHz 2 MB L2 cache, 22 nm w/ integrated Intel HD graphics, automotive

2. Rohm Co. Ltd, BD9596MWV, power management IC, automotive

3. Micron Technology Inc., MTFC16GAKAEDQ-AIT, flash, eMMC NAND, 16 GB, MLC, automotive

4. Micron Technology Inc., MT41K256M16-HA-125 AIT:E, SDRAM, DDR3L-1600, 4 Gb, automotive

5. Intel Corp., WGI210CS, Ethernet controller, single port, 1 GbE SerDes/SGMII, PCIe v2.1, 40 nm, automotive

The Ethernet switch part of the Velar infotainment controller. Source: IHS MarkitThe Ethernet switch part of the Velar infotainment controller. Source: IHS Markit

Ethernet switch PCB

1. Broadcom Ltd., BCM89501BBQLEG, Ethernet switch, 7-port, IEEE 1588/IEEE 802.1AS, 5 integrated PHYs and 2 uplink ports, 65 nm, automotive

2. Cypress Semiconductor Corp., S25FL032P0XMFA01, flash, NOR, 32 Mb, 104 MHz, SPI, automotive

3. Automotive, HSD, male, right angle, gold plated contacts

4. Automotive HSD, male, right angle, gold plated contacts

The BT/WLAN module inside the Velar infotainment controller. Source: IHS MarkitThe BT/WLAN module inside the Velar infotainment controller. Source: IHS Markit

BT/WLAN module

1. Intel Corp., DM82556CDE, BT/WLAN, IEEE802.11ac, dual-band, 2x2, MIMO, Bluetooth 4.0

Major components:

  • $142.00 - Embedded computing module, contains Intel Atom E3845 processor, 4 GB DDR3L-1600 SDRAM, automotive - MFR: Intel Corp. (Qty: 1)
  • $60.00 - SSD, 60 GB, 2.5", SATA 6 Gb/s, MLC - MFR: Toshiba Corp. (Qty: 1)
  • $25.90 - SDARS module - MFR: Mitsumi Electric Co Ltd (Qty: 1)
  • $17.62 - FPGA, Cyclone IV, 15408 logic elements, 504 Kb embedded memory, 4 PLLs, 165 user I/Os, 28 nm, automotive - MFR: Intel Corp (Qty: 1)
  • $17.62 - FPGA, Cyclone IV, 15408 logic elements, 504 Kb embedded memory, 4 PLLs, 165 user I/Os, 28 nm, automotive - MFR: Intel Corp. (Qty: 1)
  • $9.23 - 10-layer, FR4, lead-free - MFR: Unimicron Technology Corp - MPN: - (Qty: 1)
  • $9.08 - Ethernet switch, 7-port, IEEE 1588 / IEEE 802.1AS, 5 integrated PHYs & 2 uplink ports, 65 nm, automotive - MFR: Broadcom Ltd (Qty: 1)
  • $7.10 - BT/WLAN module, IEEE802.11ac, dual-band, 2x2 MIMO, Bluetooth 4.0 - MFR: Intel Corp. (Qty: 1)
  • $5.29 - Automotive pixel link transmitter, APIX2, 3 Gbps downstream, 187.5 Mbps upstream, HDMI receiver & HDCP1.4, automotive, 180 nm - MFR: Analog Devices Inc (Qty: 2)
  • $5.08 - MCU, 32-bit V850E2M core, 80 MHz, 64 KB RAM, 768 KB flash, 24-channel 12-bit ADC, 112 I/Os, 90 nm, automotive - MFR: Renesas Electronics Corp (Qty: 1)
To contact the author of this article, email engineering360editors@globalspec.com


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