Acquired Electronics360

Electronics and Semiconductors

CES 2018: TriLumina to Present 3D Solid-State LiDAR with 3D Sensing VCSEL Illumination Solutions

20 December 2017

TriLumina Corp. will demonstrate multiple use cases for its innovative 940 nm vertical-cavity surface-emitting laser (VCSEL) illumination modules at CES 2018. A novel solid-state 3D LiDAR system powered by the company’s illumination modules will be showcased at TriLumina’s suite at the Westgate Hotel as well as in the Leddar Ecosystem Pavilion in Las Vegas, Nev., during January 9-12, 2018..

These advanced LiDAR systems on display will demonstrate the integration of TriLumina's illumination technology in LeddarTech's 3D LiDAR platforms. The highly optimized LiDAR reference designs leverage Leddar patented digital signal processing algorithms. The systems are expected to accelerate the path to mass-market deployment of ADAS and autonomous driving applications by rapidly providing the reliable, high-performance, low-cost solid-state LiDAR solutions required by automotive OEMs.

TriLumina will also present new powerful illumination modules for 3D sensing, featuring patented, high-density VCSEL arrays and delivering low-cost, high-performance illumination for diverse 3D sensing applications. Patented monolithic microlenses significantly reduce the size and cost for consumer and industrial uses. The illumination modules can be used in time-of-flight, flash or structured-light applications.

According to Brian Wong, CEO of TriLumina, "TriLumina's VCSEL illumination modules address some of the most difficult technical hurdles facing several industries. At TriLumina, we are building complete line of illumination modules with our patented, back-emitting, flip-chip VCSEL arrays and driver circuits to provide the highest efficiency highest-performance illumination solutions available. The 3D, solid-state LiDAR illumination solutions presented at CES demonstrate the innovation built into our laser solutions and how they can be applied to diverse use cases in multiple markets."

To contact the author of this article, email

Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the Engineering360
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter


Date Event Location
12-16 Aug 2018 Vancouver, Canada
11-13 Sep 2018 Novi, Michigan
27 Sep 2018 The Reef, Los Angeles
03-05 Oct 2018 Boston, Massachusetts
26 Oct 2018 Old Billingsgate
Find Free Electronics Datasheets